公开(公告)号：US11121300B2

公开(公告)日：2021-09-14

申请号：US16615909

申请日：2017-08-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Chui Wai Chong ,  Teng Hai Chuah ,  Seong Tak Koay ,  Adelene Ng

IPC: H01L33/62 ,  H01L33/32 ,  H01L33/44 ,  H01L33/56

Abstract: A method of producing optoelectronic semiconductor devices includes in the stated order: A) providing a semiconductor layer sequence on a transparent wafer, the semiconductor layer sequence including an active layer; B) applying electrical contact pads on a mounting face of the semiconductor layer sequence; C) coating the semiconductor layer sequence at the mounting face and/or on the electrical contact pads with a protective layer; D) dicing the semiconductor layer sequence and the wafer to form semiconductor chips with side faces; E) forming a casting body all around the semiconductor chips directly on the side faces, the protective layer having anti-wetting properties towards a material of the casting body; and F) dicing the casting body to the optoelectronic semiconductor devices, wherein the protective layer remains on the mounting face and/or on the electrical contact pads in the finished optoelectronic semiconductor devices.

公开(公告)号：US20210074894A1

公开(公告)日：2021-03-11

申请号：US16615909

申请日：2017-08-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Chui Wai Chong ,  Teng Hai Chuah ,  Seong Tak Koay ,  Adelene Ng

IPC: H01L33/62 ,  H01L33/44 ,  H01L33/56 ,  H01L33/32

Abstract: A method of producing optoelectronic semiconductor devices includes in the stated order: A) providing a semiconductor layer sequence on a transparent wafer, the semiconductor layer sequence including an active layer; B) applying electrical contact pads on a mounting face of the semiconductor layer sequence; C) coating the semiconductor layer sequence at the mounting face and/or on the electrical contact pads with a protective layer; D) dicing the semiconductor layer sequence and the wafer to form semiconductor chips with side faces; E) forming a casting body all around the semiconductor chips directly on the side faces, the protective layer having anti-wetting properties towards a material of the casting body; and F) dicing the casting body to the optoelectronic semiconductor devices, wherein the protective layer remains on the mounting face and/or on the electrical contact pads in the finished optoelectronic semiconductor devices.