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公开(公告)号：US20220109282A1
公开(公告)日：2022-04-07
申请号：US17423209
申请日：2019-01-17
发明人： Markus BOSS , Chai Liang LOKE , Zeljko PAJKIC , Wan Leng LIM
IPC分类号： H01S5/02315 , H01S5/02
摘要： The invention refers to electronic devices (D) and to a method for obtaining electronic devices (D) comprising, electronic elements, in particular optoelectronic elements (7), the method comprising the steps of:—providing (S1) a substrate from which first walls (1) protrude along a Z-axis towards an open end side forming at least one rectangle along a X-Y-plane surrounding a respective at least one space(S);—positioning (S2) a respective electronic element (7a), in particular optoelectronic element (7),within the respective space(S)and connecting it to contact pads (9);—attaching (S3) a respective functional element (11a), in particular optical element (11), in particular a lens, at the open end side of respective first wall (1) to cover the respective space (S);—forming a second wall (2) by surrounding (S4) the respective functional element (11a), in particular optical element (11), with a darn material.
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公开(公告)号：US20210226098A1
公开(公告)日：2021-07-22
申请号：US17055309
申请日：2018-05-14
摘要： An optoelectronic device includes a substrate, an optoelectronic semiconductor component being arranged on the substrate and having a light-emitting surface, preferably on the upper side of the optoelectronic semiconductor component, and a cover being arranged on the substrate for covering the optoelectronic semiconductor component, the cover providing a cavity which surrounds the optoelectronic semiconductor component when the cover is arranged on the substrate, the cover having at least one channel which extends along a first direction in the cover from the outside to the cavity, and the first direction being not parallel to the substrate and preferably extending at least approximately perpendicular to the substrate.
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