OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND ARRANGEMENT

    公开(公告)号:US20220020707A1

    公开(公告)日:2022-01-20

    申请号:US17294954

    申请日:2019-11-07

    Abstract: An optoelectronic semiconductor component includes a semiconductor body having a main emission surface and an active region arranged to emit electromagnetic radiation. The optoelectronic semiconductor component also includes a receiving element arranged on the side of the semiconductor body opposite to the main emission surface. The optoelectronic semiconductor component also includes a radiation-transmissive molding compound. The radiation-transmissive molding compound completely surrounds the semiconductor body and the receiving element. A receiver frequency is assigned to the receiving element. The receiving element is configured to extract energy for operating the active region from an alternating electromagnetic field.

    LEAD FRAME ASSEMBLY, METHOD FOR PRODUCING A PLURALITY OF COMPONENTS, AND COMPONENT

    公开(公告)号:US20220278028A1

    公开(公告)日:2022-09-01

    申请号:US17629038

    申请日:2020-07-14

    Abstract: The invention relates to a lead frame assembly comprising a plurality of regularly arranged lead frames, each of which is suitable for electrically contacting components, comprises at least two lead frame elements distanced laterally by a recess and which are provided as electrical connections of different polarity, and has at least one anchoring element, which is suitable for anchoring a housing body of the component, the lead frame elements being thinned, flat regions of the lead frame, and the at least one anchoring element protrudes from a plane of the lead frame elements in the form of a pillar, and a plurality of connection elements, which in each case connects two lead frame elements of adjacent lead frames to one another, the two connected lead frame elements being provided as terminals of different polarity.

    OPTOELECTRONIC COMPONENT AND METHOD FOR PRODUCING AN OPTOELECTRONIC COMPONENT

    公开(公告)号:US20220262988A1

    公开(公告)日:2022-08-18

    申请号:US17627979

    申请日:2020-08-10

    Inventor: Matthias HIEN

    Abstract: An optoelectronic component includes a first semiconductor emitter and a second semiconductor emitter, each with an active region configured to generate electromagnetic radiation, and each with a front side coupling out area. The optoelectronic component also includes a radiation-impermeable cover layer and a carrier. The semiconductor emitters are on a first side of the carrier. The first semiconductor emitter is configured to emit electromagnetic radiation in a first wavelength range through its coupling out area. The second semiconductor emitter is configured to emit electromagnetic radiation in a second wavelength range through its coupling out area. The first and second wavelength ranges are different from each other. The cover layer is formed with a photopolymer, is arranged on the first side of the carrier, includes a coupling out window which completely penetrates the cover layer, and in which the coupling out areas are at least partially free of the cover layer.

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