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公开(公告)号：US20230042041A1
公开(公告)日：2023-02-09
申请号：US17792679
申请日：2020-12-18
发明人： Karlheinz ARNDT , Matthias GOLDBACH , Simon JEREBIC , Matthias HOFMANN , Markus BOSS , Constantin HETZER , Harald JAEGER , Jens EBERHARD , Sebastian STOLL
摘要： The Invention relates to a housing for an optoelectronic semiconductor component, comprising: a housing main body, which has a chip mounting side, at least two electrical conducting structures in and/or on the housing main body, and a plurality of drainage structures on the chip mounting side. The electrical conducting structures form, on the chip mounting side, electrical contact surfaces for at least one optoelectronic semiconductor chip and the drainage structure are designed as means for feeding a liquid potting material to the electrical contact surfaces.
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公开(公告)号：US20220020707A1
公开(公告)日：2022-01-20
申请号：US17294954
申请日：2019-11-07
发明人： Matthias HIEN , Matthias GOLDBACH
摘要： An optoelectronic semiconductor component includes a semiconductor body having a main emission surface and an active region arranged to emit electromagnetic radiation. The optoelectronic semiconductor component also includes a receiving element arranged on the side of the semiconductor body opposite to the main emission surface. The optoelectronic semiconductor component also includes a radiation-transmissive molding compound. The radiation-transmissive molding compound completely surrounds the semiconductor body and the receiving element. A receiver frequency is assigned to the receiving element. The receiving element is configured to extract energy for operating the active region from an alternating electromagnetic field.
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公开(公告)号：US20220227230A1
公开(公告)日：2022-07-21
申请号：US17615396
申请日：2020-10-29
发明人： Matthias GOLDBACH , Stefan GROETSCH , Ludwig HOFBAUER , Sebastian WITTMANN , Robert REGENSBURGER , Thomas SCHWARZ , Michael BRANDL , Andreas DOBNER , Sebastian STIGLER
摘要： An optoelectronic device comprises a plurality of layer segments, in particular intermediate layer segments, arranged between a cover layer and a carrier layer. At least one optoelectronic component is arranged on at least one of the plurality of layer segments and a first and a second layer segment of the plurality of the layer segments are overlapping each other along a first direction each forming a respective boundary region. The first layer segment comprises at least one first contact pad and the second layer segment comprises at least one second contact pad, wherein the at least one first and second contact pad are arranged in the respective boundary region facing each other and being mechanically and electrically connected. The at least one first and second contact pad each comprises a plurality of nanowires which are at least partially made of conductive material such as for example copper, gold, or nickel.
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公开(公告)号：US20220199873A1
公开(公告)日：2022-06-23
申请号：US17432407
申请日：2020-02-13
发明人： Matthias GOLDBACH , Andreas DOBNER
摘要： An optoelectronic component is specified, with an optoelectronic semiconductor chip which, in operation, is configured to emit or detect electromagnetic radiation, a connection carrier, on which the semiconductor chip is arranged, an electrically conductive connection, which is electrically conductively connected to the semiconductor chip and/or the connection carrier, and an electrically insulating material, which surrounds the semiconductor chip and/or the connection carrier at least in places, wherein the electrically conductive connection is arranged in places on the electrically insulating material. Furthermore, a method for producing an optoelectronic component is specified.
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5.发明申请SEMICONDUCTOR CHIP AND METHOD OF SEPARATING A COMPOSITE INTO SEMICONDUCTOR CHIPS 有权半导体芯片和将复合材料分离成半导体芯片的方法公开(公告)号：US20160240736A1
公开(公告)日：2016-08-18
申请号：US15027971
申请日：2014-10-06
发明人： Matthias GOLDBACH
CPC分类号： H01L33/20 , H01L33/0066 , H01L33/0095 , H01L33/16 , H01L33/30 , H01L33/38 , H01L33/385
摘要： The invention concerns a semiconductor chip (100) with a semiconductor body (2) having a semiconductor layer sequence, and with a substrate body (4) and at least one upper side contact (8). In projection the semiconductor chip (100) has a shape which deviates from a rectangular shape. The invention also concerns a method of separating a composite into a plurality of semiconductor chips (100) along a separation pattern (15) with the steps enabling a plurality of semiconductor chips according to the invention to be produced.
摘要翻译： 本发明涉及具有半导体层序列的半导体本体（2）和具有基底主体（4）和至少一个上侧触点（8）的半导体芯片（100）。 在投影中，半导体芯片（100）具有偏离矩形形状的形状。 本发明还涉及一种将复合材料沿着分离图案（15）分离成多个半导体芯片（100）的方法，其中使得能够制造根据本发明的多个半导体芯片的步骤。
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公开(公告)号：US20220352135A1
公开(公告)日：2022-11-03
申请号：US17762142
申请日：2020-10-08
IPC分类号： H01L25/16 , H01L33/62 , H01L23/495
摘要： An optoelectronic component includes at least one optoelectronic semiconductor chip with a main surface on which two electrical contacts are arranged. The optoelectronic component also includes a control chip for controlling the optoelectronic semiconductor chip with a plurality of electrical connection pads. The optoelectronic component further includes a housing with a housing body. The optoelectronic semiconductor chip is arranged with a mounting surface, which extends transversely to the main surface, in a first recess of the housing body. A side surface of the first recess forms an obtuse tilt angle with a bottom surface of the first recess. At least one of the electrical contacts of the optoelectronic semiconductor chip is electrically conductively connected to an electrical connection pad of the control chip via a conductor path. The conductor path is arranged at least in places on the side surface of the first recess.
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公开(公告)号：US20220289028A1
公开(公告)日：2022-09-15
申请号：US17615738
申请日：2020-10-29
发明人： Ludwig HOFBAUER , Armin WETTERER , Michael WITTMANN , Hanna SCHULZ , Sebastian WITTMANN , Andreas DOBNER , Ulrich FREI , Matthias GOLDBACH
IPC分类号： B60K35/00
摘要： An optoelectronic apparatus comprises a transparent first cover, at least layer two carriers mounted on the first cover, wherein a plurality of optoelectronic elements configured to emit light are attached to each of the at least two carriers, and a second cover mounted on the at least two carriers, wherein the second cover has at least partially a lower optical transmittance than the first cover and/or the at least two carriers.
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公开(公告)号：US20220238497A1
公开(公告)日：2022-07-28
申请号：US17615446
申请日：2020-10-29
发明人： Michael BRANDL , Andreas DOBNER , Matthias GOLDBACH , Sebastian WITTMANN , Uli HILLER , Markus KLEIN , Thomas SCHWARZ , Andreas WALDSCHIK , Michael WITTMANN , Matthias BRUCKSCHLOEGL , Stefan GROETSCH , Rainer HUBER , Peter BRICK , Ludwig HOFBAUER
IPC分类号： H01L25/075 , H01L33/60
摘要： An optoelectronic device, in particular an at least semi-transparent pane for example for a vehicle, comprises: a cover layer, a carrier layer, an intermediate layer between the cover layer and the carrier layer, wherein at least one and preferably a plurality of optoelectronic light sources, in particular μLEDS, is arranged on at least one surface of the intermediate layer and/or is at least partially embedded in the intermediate layer, wherein the intermediate layer is adapted such that light emitted by the optoelectronic light sources at least partially spreads in and along the intermediate layer and exits the intermediate layer within and/or at a pre-set distance to the respective optoelectronic light source in a direction through the cover layer and/or through the carrier layer.
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公开(公告)号：US20180166428A1
公开(公告)日：2018-06-14
申请号：US15574926
申请日：2016-05-17
发明人： Matthias GOLDBACH , Juergen HOLZ , Stefan ILLEK , Stefan GROETSCH
摘要： A light source includes a plurality of semiconductor components, wherein a semiconductor component includes a plurality of light-emitting diodes, the diodes are arranged in a predefined grid in at least one column in or on the semiconductor component, and a control circuit that drives the individual diodes is arranged on the semiconductor component.
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公开(公告)号：US20240278645A1
公开(公告)日：2024-08-22
申请号：US18652629
申请日：2024-05-01
发明人： Matthias GOLDBACH , Stefan Grötsch , Lugwig Hofbauer , Sebastian Wittmann , Robert Regensburger , Thomas Schwarz , Michael Brandl , Andreas Dobner , Sebastian Stigler
CPC分类号： B60K35/00 , H01B3/30 , H01B7/0018 , H01B13/103 , H01L33/62 , B60K35/60 , B60K2360/332 , B60K2360/47 , B60K2360/48 , B60K2360/785 , H01L2933/0066
摘要： It is provided a window of a vehicle, optoelectronic circuits, in particular optoelectronic circuits for a window of a vehicle and a method for manufacturing a window of a vehicle including at least one optoelectronic component. It is further provided a display comprising at least one display module each comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED. In addition, a method for manufacturing a display module comprising at least one optoelectronic array with a plurality of optoelectronic components, each optoelectronic component forming a pixel comprising at least one subpixel, in particular a μLED, is provided.
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