公开(公告)号：US20220344899A1

公开(公告)日：2022-10-27

申请号：US17760965

申请日：2019-09-18

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Roberto DOSSI ,  Massimo Cataldo MAZZILLO

IPC: H01S5/042 ,  H01S5/02326 ,  H01S5/42 ,  H01S5/183 ,  H01S5/02253 ,  H01S5/02

Abstract: An optoelectronic semiconductor chip comprises a semiconductor body including a plurality of active regions configured to generate electromagnetic radiation, the plurality of active regions being arranged in a horizontal plane. The optoelectronic semiconductor chip further comprises a conductive member configured to electrically connect at least two adjacent ones of the active regions with each other, the conductive member being arranged over a first main surface of the semiconductor body. The optoelectronic semiconductor chip further comprises a contact element extending from the first main surface to a second main surface of the semiconductor body and being electrically connected to at least one of the active regions via a contact material over the first main surface, and an optical element arranged over the first main surface of the semiconductor body.