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1.发明申请公开(公告)号：US20200075818A1
公开(公告)日：2020-03-05
申请号：US16491146
申请日：2018-03-06
发明人： Markus Pindl , Markus Burger , Markus Boss , Matthias Lermer
摘要： A method for producing at at least an optoelectronic component and an optoelectronic component are disclosed. In an embodiment a method includes providing a substrate having at least one aperture, applying at least one semiconductor chip to the substrate, arranging barrier structures provided that the barrier structures are not already part of the substrate, wherein the semiconductor chip is spaced apart from the barrier structures as seen in a side cross-section, applying an auxiliary carrier at least to a main radiation exit surface and to the barrier structures, introducing a casting material via the at least one aperture in the substrate so that the casting material is arranged between the barrier structures and the semiconductor chip and between the substrate and the auxiliary carrier, and curing the casting material.
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公开(公告)号：US11413834B2
公开(公告)日：2022-08-16
申请号：US16318879
申请日：2017-07-18
发明人： Marco Wittmann , Markus Boss
IPC分类号： B29D11/00
摘要： A method of producing optical components includes providing an initial carrier including cutouts; carrying out a molding process to form transparent optical molded parts arranged in the cutouts of the initial carrier, wherein a molding compound is introduced into the cutouts of the initial carrier and the molding compound is molded and cured; and singulating the initial carrier including the optical molded parts so that separate optical components are formed that respectively include a carrier produced from the initial carrier and including a cutout, and an optical molded part arranged in the cutout.
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3.发明申请公开(公告)号：US20150255313A1
公开(公告)日：2015-09-10
申请号：US14436578
申请日：2013-10-14
发明人： Martin Brandl , Markus Boss , Markus Pindl , Simon Jerebic , Herbert Brunner , Tobias Gebuhr
CPC分类号： H01L21/563 , H01L21/561 , H01L21/568 , H01L21/78 , H01L23/3107 , H01L23/49541 , H01L23/49548 , H01L24/48 , H01L24/85 , H01L24/97 , H01L31/0203 , H01L33/0095 , H01L33/486 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/85001 , H01L2924/00014 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/18301 , H01L2933/0041 , H01L2933/005 , H01L2933/0066 , H01L2924/00 , H01L2224/45099 , H01L2924/00012
摘要： Optoelectronic semiconductor devices and methods for producing optoelectronic semiconductor devices are disclosed. In an embodiment the method includes applying a plurality of arrangements of electrically conductive first and second contact elements on an auxiliary carrier, applying an optoelectronic semiconductor chip on the second contact element of each arrangement and electrically conductively connecting the optoelectronic semiconductor chip to the first contact element for each arrangement. The method further includes encapsulating the first contact elements and the second contact elements with an encapsulation material to form an encapsulation body and singulating the encapsulation body into a plurality of optoelectronic semiconductor devices, wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each first contact element, and wherein the encapsulation material finishes flush with an underside, facing the auxiliary carrier, of each second contact element.
摘要翻译： 公开了用于制造光电半导体器件的光电半导体器件和方法。 在一个实施例中，该方法包括在辅助载体上施加导电的第一和第二接触元件的多个布置，在每个布置的第二接触元件上施加光电子半导体芯片，并将光电子半导体芯片导电连接到第一接触元件 为每个安排。 该方法还包括用封装材料封装第一接触元件和第二接触元件以形成封装主体，并将封装主体分成多个光电子半导体器件，其中封装材料与下侧齐平，面向辅助载体 的每个第一接触元件，并且其中所述封装材料与每个第二接触元件的面向所述辅助载体的底面齐平。
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公开(公告)号：US20220171057A1
公开(公告)日：2022-06-02
申请号：US17432326
申请日：2020-02-21
发明人： Fabian Knorr , Tony Albrecht , Markus Boss
IPC分类号： G01S17/08 , G01S7/481 , G01S7/484 , G01S7/4865
摘要： In an embodiment, the optoelectronic semiconductor device comprises an optoelectronic semiconductor chip for emitting a radiation. An optical element is disposed downstream of the semiconductor chip. The semiconductor chip and the optical element are embedded in a potting body. The optical element comprises a structured, contiguous and optically effective area, which is located inside the optical element directly at an optical contrast region, preferably an evacuated or gas-filled cavity. The optically effective area completely covers a radiation exit area of the semiconductor chip.
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公开(公告)号：US20180308894A1
公开(公告)日：2018-10-25
申请号：US15959425
申请日：2018-04-23
发明人： Markus Burger , Markus Pindl , Markus Boss
IPC分类号： H01L27/146 , G02B6/42 , G02B6/43 , G02B7/02
CPC分类号： H01L27/14685 , G02B6/4206 , G02B6/43 , G02B7/025 , H01L27/14627
摘要： A method of producing an optoelectronic device includes providing an optical element including an optical lens and including a frame, wherein the frame projects with a receptacle section beyond a first side of the lens, the receptacle section of the frame surrounds a receptacle space, and the receptacle section of the frame includes a bearing face at an inner side; inserting an optoelectronic component and a transparent intermediate element into the receptacle space; placing the intermediate element onto the bearing face; and securing the component and the intermediate element to the frame.
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公开(公告)号：US20150214446A1
公开(公告)日：2015-07-30
申请号：US14410956
申请日：2013-06-18
发明人： Markus Boss , Markus Pindl , Tobias Gebuhr , Simon Jerebic , Martin Brandl
CPC分类号： H01L33/54 , H01L21/565 , H01L21/78 , H01L23/29 , H01L23/49811 , H01L23/49861 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2933/005 , H01L2924/00014
摘要： An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.
摘要翻译： 电气部件包括具有通道开口的封闭引线框架，所述通道开口至少设置在通道开口内的电气部件，所述电气部件包括在所述电气部件的一侧上的第一接触焊盘和所述电气部件的第二侧上的第二接触焊盘 其中所述第二侧面向所述第一侧，并且所述第二接触焊盘电耦合到所述引线框架; 以及封装，其将所述电气部件机械耦合到所述引线框架，其中所述引线框架包括在一侧上的凹部，所述凹部从所述引线框架的边缘延伸到所述通道开口，并且将至少一个电连接元件从所述边缘 引导框架布置在通道开口中的部件。
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公开(公告)号：US11662223B2
公开(公告)日：2023-05-30
申请号：US16662137
申请日：2019-10-24
发明人： Zeljko Pajkic , Markus Boss , Thomas Kippes
IPC分类号： G01D5/14 , H05K9/00 , H01L25/16 , H01L31/0203 , H01L31/0232 , H01L23/552 , H01S5/02257 , H01S5/02325 , H01S5/02216 , H01S5/183
CPC分类号： G01D5/14 , H01L23/552 , H01L25/165 , H01L25/167 , H01L31/0203 , H01L31/02325 , H01S5/02257 , H01S5/02325 , H05K9/0024 , H01S5/02216 , H01S5/183
摘要： An optoelectronic device comprises a substrate, an optoelectronic element mounted on the substrate, a shielding cap providing electromagnetic shielding, at least one optical element attached to the shielding cap, and a detection element configured to detect if the shielding cap is mounted on the substrate.
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公开(公告)号：US20190181310A1
公开(公告)日：2019-06-13
申请号：US16326731
申请日：2017-08-23
发明人： Markus Boss , Tobias Gebuhr
IPC分类号： H01L33/56 , H01L25/075 , H01L33/54
CPC分类号： H01L33/56 , H01L21/561 , H01L21/565 , H01L21/568 , H01L25/0753 , H01L33/0095 , H01L33/54 , H01L2933/005
摘要： A method of producing an optoelectronic component includes providing a carrier having an upper side; providing a mat configured as a fiber-matrix semifinished product and having a through-opening; arranging an optoelectronic semiconductor chip over the upper side of the carrier; arranging the mat over the upper side of the carrier such that the optoelectronic semiconductor chip is arranged in the opening of the mat; and compacting the mat to form a composite body including the mat and the optoelectronic semiconductor chip.
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公开(公告)号：US20190009441A1
公开(公告)日：2019-01-10
申请号：US15752455
申请日：2016-08-11
发明人： Stephan Eicher , Martin Brandl , Markus Boss
摘要： A method of producing a carrier substrate for an optoelectronic semiconductor component includes: providing a leadframe including a first electrically conductive contact section and a second electrically conductive contact section, and injection molding a housing including a housing frame embedding the leadframe by an injection-molding material free of epoxy such that the leadframe embedded in the housing frame of the injection-molded housing forms a carrier substrate for an optoelectronic semiconductor component.
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公开(公告)号：US09209367B2
公开(公告)日：2015-12-08
申请号：US14410956
申请日：2013-06-18
发明人： Markus Boss , Markus Pindl , Tobias Gebuhr , Simon Jerebic , Martin Brandl
IPC分类号： H01L33/00 , H01L33/54 , H01L33/48 , H01L33/62 , H01L21/56 , H01L21/78 , H01L23/29 , H01L23/498 , H01L33/58
CPC分类号： H01L33/54 , H01L21/565 , H01L21/78 , H01L23/29 , H01L23/49811 , H01L23/49861 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2933/005 , H01L2924/00014
摘要： An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.
摘要翻译： 电气部件包括具有通道开口的封闭引线框架，所述通道开口至少设置在通道开口内的电气部件，所述电气部件包括在所述电气部件的一侧上的第一接触焊盘和所述电气部件的第二侧上的第二接触焊盘 其中所述第二侧面向所述第一侧，并且所述第二接触焊盘电耦合到所述引线框架; 以及封装，其将所述电气部件机械耦合到所述引线框架，其中所述引线框架包括在一侧上的凹部，所述凹部从所述引线框架的边缘延伸到所述通道开口，并且将至少一个电连接元件从所述边缘 引导框架布置在通道开口中的部件。
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