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公开(公告)号：US12019271B2
公开(公告)日：2024-06-25
申请号：US18301520
申请日：2023-04-17
Applicant: Ohio State Innovation Foundation
Inventor： Ronald Reano , Jonathan Nagy , Karan Prabhakar , Ryan Patton
CPC classification number: G02B6/125 , G02B6/12002 , G02B6/12019 , G02B2006/12147
Abstract: A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.
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公开(公告)号：US20230324610A1
公开(公告)日：2023-10-12
申请号：US18301520
申请日：2023-04-17
Applicant: Ohio State Innovation Foundation
Inventor： Ronald Reano , Jonathan Nagy , Karen Prabhakar , Ryan Patton
CPC classification number: G02B6/125 , G02B6/12002 , G02B6/12019 , G02B2006/12147
Abstract: A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.
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公开(公告)号：US11662520B2
公开(公告)日：2023-05-30
申请号：US17205522
申请日：2021-03-18
Applicant: Ohio State Innovation Foundation
Inventor： Ronald Reano , Jonathan Nagy , Karan Prabhakar , Ryan Patton
CPC classification number: G02B6/125 , G02B6/12002 , G02B6/12019 , G02B2006/12147
Abstract: A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.
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公开(公告)号：US20210364696A1
公开(公告)日：2021-11-25
申请号：US17205522
申请日：2021-03-18
Applicant: Ohio State Innovation Foundation
Inventor： Ronald Reano , Jonathan Nagy , Karan Prabhakar , Ryan Patton
Abstract: A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.
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