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公开(公告)号：US20230324610A1
公开(公告)日：2023-10-12
申请号：US18301520
申请日：2023-04-17
Applicant: Ohio State Innovation Foundation
Inventor： Ronald Reano , Jonathan Nagy , Karen Prabhakar , Ryan Patton
CPC classification number: G02B6/125 , G02B6/12002 , G02B6/12019 , G02B2006/12147
Abstract: A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.
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Patent Agency Ranking
公开(公告)号：US10418238B2
公开(公告)日：2019-09-17
申请号：US15978606
申请日：2018-05-14
Applicant: Ohio State Innovation Foundation
Inventor： Ronald M. Reano , Michael Wood , Ryan Patton
IPC: G02F1/295 , H01L21/02 , H01L31/0232 , G02B6/12 , G02F1/025 , G02B6/122 , G02B6/42 , G02F1/01 , G02F1/313
Abstract: Amorphous silicon devices, systems, and related methods are described herein. An example method for fabricating a thin film with light-emitting or light-detecting capability can include depositing a thin film of amorphous silicon on a wafer such that crystalline defects are distributed throughout the thin film. Additionally, an example photonic device can include a p-doped region and an n-doped region formed on a wafer, and a resonator structure formed on the wafer. The resonator structure can be formed from amorphous silicon and can be arranged between the p-doped and n-doped regions to form a PIN junction. Optionally, the photonic device can be incorporated into a monolithic integrated optical system.
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公开(公告)号：US12019271B2
公开(公告)日：2024-06-25
申请号：US18301520
申请日：2023-04-17
Applicant: Ohio State Innovation Foundation
Inventor： Ronald Reano , Jonathan Nagy , Karan Prabhakar , Ryan Patton
CPC classification number: G02B6/125 , G02B6/12002 , G02B6/12019 , G02B2006/12147
Abstract: A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.
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公开(公告)号：US11662520B2
公开(公告)日：2023-05-30
申请号：US17205522
申请日：2021-03-18
Applicant: Ohio State Innovation Foundation
Inventor： Ronald Reano , Jonathan Nagy , Karan Prabhakar , Ryan Patton
CPC classification number: G02B6/125 , G02B6/12002 , G02B6/12019 , G02B2006/12147
Abstract: A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.
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公开(公告)号：US20210364696A1
公开(公告)日：2021-11-25
申请号：US17205522
申请日：2021-03-18
Applicant: Ohio State Innovation Foundation
Inventor： Ronald Reano , Jonathan Nagy , Karan Prabhakar , Ryan Patton
Abstract: A fiber-to-fiber system for multi-layer ferroelectric on insulator waveguide devices is described. The system comprises a fiber-to-chip coupler that couples light from a standard optical fiber to multi-layer ferroelectric on insulator waveguides. The multi-layer ferroelectric on insulator waveguides are integrated with electrodes to implement an optical device, an electro-optical device, or a non-linear optical device, such as an electro-optical modulator, with microwave and optical waveguide crossings compatible with packaging. A second fiber-to-chip coupler outputs the light from the multi-layer ferroelectric on insulator device to a standard optical fiber.
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6.发明申请公开(公告)号：US20180330946A1
公开(公告)日：2018-11-15
申请号：US15978606
申请日：2018-05-14
Applicant: Ohio State Innovation Foundation
Inventor： Ronald M. Reano , Michael Wood , Ryan Patton
CPC classification number: H01L21/02238 , G02B6/12004 , G02B6/12009 , G02B6/1223 , G02B6/1225 , G02B6/42 , G02B2006/12061 , G02B2006/12123 , G02B2006/12138 , G02B2006/12178 , G02F1/0136 , G02F1/025 , G02F1/313 , H01L21/02252 , H01L31/0232
Abstract: Amorphous silicon devices, systems, and related methods are described herein. An example method for fabricating a thin film with light-emitting or light-detecting capability can include depositing a thin film of amorphous silicon on a wafer such that crystalline defects are distributed throughout the thin film. Additionally, an example photonic device can include a p-doped region and an n-doped region formed on a wafer, and a resonator structure formed on the wafer. The resonator structure can be formed from amorphous silicon and can be arranged between the p-doped and n-doped regions to form a PIN junction. Optionally, the photonic device can be incorporated into a monolithic integrated optical system.
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