公开(公告)号：US06778037B1

公开(公告)日：2004-08-17

申请号：US10009273

申请日：2002-04-02

申请人： Olli Salmela ,  Esa Kemppinen ,  Markku Koivisto ,  Hans Somerma ,  Pertti Ikäläinen ,  Petri Savolainen

发明人： Olli Salmela ,  Esa Kemppinen ,  Markku Koivisto ,  Hans Somerma ,  Pertti Ikäläinen ,  Petri Savolainen

IPC分类号： H01P308

CPC分类号： H01P5/186 ,  H01P5/16

摘要： The invention relates to structures, by which part of the incoming high-frequency energy can be separated to its own path (out1) or energies coming from different paths can be combined to a common path. The basic idea of the invention is that all components of the dividing or combining means are integrated into a monolithic structure in an insulating material, preferably multilayer ceramics. The transmission line strips (311) and other conductors are formed by printing conductive material on the outer surface of the ceramic piece (301) and in its interlayers, when required. The conductors between the surfaces are formed by filling the hole made through the layer or layers with conductive material. The resistive components (321) parallel with and between the surfaces are formed in a similar manner. The structure according to the invention is relatively small and reliable, and its manufacturing costs are low.

摘要翻译： 本发明涉及一些结构，通过该结构，可以将输入的高频能量的一部分分离成其自身的路径（out1）或来自不同路径的能量可以组合到公共路径。 本发明的基本思想是分割或组合装置的所有部件被整合成绝缘材料的整体结构，优选多层陶瓷。 传输线条（311）和其它导体通过在需要时在陶瓷片（301）的外表面上和其中间层中印刷导电材料形成。 表面之间的导体通过用导电材料填充通过该层制成的孔而形成。 以类似的方式形成平行于表面之间和之间的电阻元件（321）。 本发明的结构相对小且可靠，其制造成本低。

公开(公告)号：US06909345B1

公开(公告)日：2005-06-21

申请号：US10030502

申请日：2000-07-10

申请人： Olli Salmela ,  Esa Kemppinen ,  Hans Somerma ,  Pertti Ikäläinen ,  Markku Koivisto

发明人： Olli Salmela ,  Esa Kemppinen ,  Hans Somerma ,  Pertti Ikäläinen ,  Markku Koivisto

IPC分类号： H01P3/12 ,  H01P11/00 ,  H01P3/18

CPC分类号： H01P3/121 ,  Y10T29/49016

摘要： The invention relates to a waveguide manufacturing and a waveguide manufactured with the method, which can be integrated into a circuit structure manufactured with the multilayer ceramic technique. The core part (23, 33, 43, 53a, 53b, 53c) of the waveguide is formed by a unit assembled of ceramic layers, which is limited in the yz plane by two impedance discontinuities and in the xz plane by two planar surfaces (24, 25, 34, 35, 54a, 54c, 55a, 55b, 55c) made of conductive material. The conductive surfaces can be connected to each other by vias made of conductive material (38, 39, 48, 49). The waveguide manufactured with the method according to the invention is a fixed part of the circuit structure as a whole.

摘要翻译： 本发明涉及一种使用该方法制造的波导制造和波导，其可以集成到由多层陶瓷技术制造的电路结构中。 波导的核心部分（23,33,43,53a，53b，53c）由陶瓷层组成的单元形成，陶瓷层在yz平面中受到两个阻抗不连续的限制，在xz平面上被两个 由导电材料制成的平面（24,25,34,35,54a，54c，55a，55b，55c）。 导电表面可以通过由导电材料（38,39,48,49）制成的通孔彼此连接。 使用根据本发明的方法制造的波导作为整体的电路结构的固定部分。

公开(公告)号：US06639487B1

公开(公告)日：2003-10-28

申请号：US09869473

申请日：2001-09-20

申请人： Olli Salmela ,  Pertti Ikäläinen

发明人： Olli Salmela ,  Pertti Ikäläinen

IPC分类号： H01P508

CPC分类号： H01P5/028

摘要： The invention is directed to a method for matching characteristic impedances in a wideband manner. The matching of characteristic impedances is realized by tapering a conductor inside a wall composed of a dielectric material. The tapered conductor is either an asymmetric stripline or an asymmetric coplanar line. The method enables characteristic impedance matching at up to 40 GHz. The coupler is applicable to signal line feedthroughs in MMIC packages.

摘要翻译： 本发明涉及一种用于以宽带方式匹配特征阻抗的方法。 特征阻抗的匹配是通过在由介电材料构成的壁内部的导体锥形来实现的。 锥形导体是非对称带状线或非对称共面线。 该方法可实现高达40 GHz的特征阻抗匹配。 耦合器适用于MMIC封装中的信号线馈通。