公开(公告)号：US06791429B2

公开(公告)日：2004-09-14

申请号：US10697130

申请日：2003-10-30

申请人： Frank G. Mikalauskas

发明人： Frank G. Mikalauskas

IPC分类号： H01P308

CPC分类号： H05K1/0248 ,  G01R31/2853 ,  H05K1/0219 ,  H05K1/025 ,  H05K2201/0792 ,  H05K2201/09236 ,  H05K2201/09727

摘要： A discontinuity, such as a via, in a signal transmission line can introduce a parasitic element that affects the signal transmission. The method in accordance with embodiments of the present invention are directed to counteracting the transmission line parasitic element discontinuity. The method includes determining the amount of parasitic capacitance or inductance that is introduced at a portion of the transmission line, such as by the via. A suitable amount of delay is introduced to the transmission line by way of correction impedance in order to counteract the affects of the parasitic element. The delay is calculated taking into account at least in part the correction impedance and the parasitic element effect. The correction impedance is suitably added to a portion of the transmission line at which the parasitic element is present.

摘要翻译： 在信号传输线路中的诸如通路的不连续性可以引入影响信号传输的寄生元件。 根据本发明的实施例的方法旨在抵消传输线寄生元件不连续性。 该方法包括例如通过通孔确定在传输线的一部分处引入的寄生电容或电感的量。 通过校正阻抗将适当的延迟量引入传输线，以抵消寄生元件的影响。 至少部分地考虑校正阻抗和寄生元件效应来计算延迟。 校正阻抗适当地添加到存在寄生元件的传输线的一部分。

公开(公告)号：US06768400B2

公开(公告)日：2004-07-27

申请号：US09838214

申请日：2001-04-20

申请人： Mitsuru Tanabe

发明人： Mitsuru Tanabe

IPC分类号： H01P308

CPC分类号： H01P3/088

摘要： A microstrip line includes a ground conductor layer, a dielectric layer formed on the ground conductor layer, and a linear conductor layer formed on the dielectric layer to have a linear configuration. The linear conductor layer has a wider portion in the upper part of a cross section thereof taken in a direction perpendicular to the direction in which the linear conductor layer extends and a narrower portion in the lower part of the cross section. The narrower portion is smaller in width than the wider portion.

摘要翻译： 微带线包括接地导体层，形成在接地导体层上的电介质层，以及形成在电介质层上的具有线性构造的线状导体层。 线状导体层的截面的上部的宽度部分沿垂直于线状导电体层延伸的方向的方向和横截面的下部的较窄部分具有较宽的部分。 较窄部分的宽度小于较宽部分。

公开(公告)号：US06677839B2

公开(公告)日：2004-01-13

申请号：US10261684

申请日：2002-10-02

申请人： Hiroshi Aruga

发明人： Hiroshi Aruga

IPC分类号： H01P308

CPC分类号： H01P5/08 ,  H01P1/047

摘要： A vertical transition device for differential stripline paths, connects differential microstrip paths on a horizontal plane with differential triplate paths on another horizontal plane in a multilayered architecture. The differential microstrip paths include a pair of differential microstrip lines. The differential triplate paths include a pair of triplate lines. The differential microstrip lines are connected with the differential triplate lines by via-holes within the transition device, respectively.

摘要翻译： 用于差分带状线路径的垂直转换装置在多层结构中的另一个水平平面上将水平面上的微分微带路径与差分三板路径连接。 差分微带线路包括一对差分微带线。 差分三板路径包括一对三板板线。 差分微带线分别通过过渡装置内的通孔与差动板条线连接。

公开(公告)号：US06642809B2

公开(公告)日：2003-11-04

申请号：US10011317

申请日：2001-12-11

申请人： Ji-Hwan Shin ,  Seung-Gyo Jeong

发明人： Ji-Hwan Shin ,  Seung-Gyo Jeong

IPC分类号： H01P308

CPC分类号： H01P5/185

摘要： Disclosed herein is a multi-layer chip directional coupler. The multi-layer chip directional coupler has a first ground pattern, a coupling signal line, a main signal line, a second ground pattern, and a plurality of ports. The first ground pattern is formed on the upper surface of a first dielectric layer. The coupling signal line is formed of a conduction pattern on the upper surface of a second dielectric layer. The main signal line is formed of a conduction pattern on the upper surface of a third dielectric layer formed over the second dielectric layer. The second ground pattern formed on the upper surface of a fourth dielectric layer formed over the third dielectric layer. A plurality of ports is formed on the side surfaces of the first to fourth dielectric layers.

公开(公告)号：US06636075B2

公开(公告)日：2003-10-21

申请号：US10060390

申请日：2002-02-01

申请人： Michiaki Nakayama ,  Masato Hamamoto ,  Kazutaka Mori ,  Satoru Isomura

发明人： Michiaki Nakayama ,  Masato Hamamoto ,  Kazutaka Mori ,  Satoru Isomura

IPC分类号： H01P308

CPC分类号： H01L27/1104 ,  H01L27/0921 ,  H01L27/0928

摘要： An integrated circuit having a CMOS circuit constituted by electrically connecting an n-type well 2, in which p-channel transistor Tp of the CMOS circuit is set, with a supply line Vdd through switching transistor Tps, and electrically connecting a p-type well 3, in which n-channel transistor Tn of the CMOS circuit is set, with supply line Vss through switching transistor Tns. Thermal runaway due to leakage current can be controlled by turning off switching transistors Tps and Tns and supplying potentials suitable for a test to the n-type well 2 and the p-type well 3 from an external unit when the integrated circuit is being tested. Fluctuations of the latch-up phenomenon and operation speed can be prevented by turning on switching transistors Tps and Tns and setting the n-type well 2 and the p-type well 3 to the voltages Vdd and Vss, respectively.

公开(公告)号：US06624729B2

公开(公告)日：2003-09-23

申请号：US09752059

申请日：2000-12-29

申请人： Mitchel E. Wright ,  Joseph Stoddard

发明人： Mitchel E. Wright ,  Joseph Stoddard

IPC分类号： H01P308

CPC分类号： H01P3/085 ,  H01P3/081 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/0715 ,  H05K2201/09263 ,  H05K2201/09681 ,  H05K2201/0969

摘要： A circuit in a printed circuit board includes a trace and a ground plane coupled to the trace that includes slots in the vicinity of the trace. The slots are dimensioned and arrayed such that the trace has a controlled impedance. An array of slots progressing in a direction parallel to the trace preferably includes repeating subarrays displaced by a repeat distance in a direction parallel to the trace that is less than a characteristic wavelength of a signal propagated on the trace, coupling distributively with the trace. The slots may be polygonal, arcuate, or a combination of both in shape. The printed circuit board may include a second trace coupled to the first. Further, the printed circuit board may include a second ground plane that includes slots that couple to the trace.

公开(公告)号：US06556849B2

公开(公告)日：2003-04-29

申请号：US09353649

申请日：1999-07-15

申请人： Shu-Ang Zhou ,  Erland Wikborg

发明人： Shu-Ang Zhou ,  Erland Wikborg

IPC分类号： H01P308

CPC分类号： H01P3/081

摘要： An inductor for microwave frequencies has a substantially planar structure and is constructed of a transmission line designed as a linear microstrip element made of a central line comprising normal electrically conducting material, such as a suitable metal. The microstrip element has a width which is varied by making areas at sides of the central line superconducting. By changing the effective width of the microstrip, the inductance of the microstrip is changed accordingly. The areas at the sides of the microstrip element in the non-superconducting state may have some electrical conductivity. However, because they contact the central metal conductor only at a very narrow edge, instead of contacting it at a large surface, the side superconducting areas do not significantly affect the transmission characteristics of the transmission path when the superconducting areas are in the normal state.

摘要翻译： 用于微波频率的电感器具有基本上平面的结构，并且由传输线构成，该传输线被设计为由包括普通导电材料（例如合适的金属）的中心线制成的线性微带线元件。 微带元件具有通过使中心线侧面的区域超导而变化的宽度。 通过改变微带的有效宽度，相应地改变微带的电感。 在非超导状态的微带元件侧面的区域可能具有一些导电性。 然而，由于它们仅在非常窄的边缘处接触中心金属导体，而不是在大表面处接触中心金属导体，所以当超导区域处于正常状态时，侧面超导区域不会显着影响传输路径的传输特性。

公开(公告)号：US06437669B1

公开(公告)日：2002-08-20

申请号：US09675639

申请日：2000-09-29

申请人： Robert B. Welstand ,  Timothy L. Leclair

发明人： Robert B. Welstand ,  Timothy L. Leclair

IPC分类号： H01P308

CPC分类号： H01L24/16 ,  H01L23/66 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0237 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/017 ,  H05K2201/09909 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2224/05599

摘要： An interface have been provided to permit the formation of solder connections between substrates suitable for microwave to millimeter wave frequencies. Specifically, signal traces on the substrate are selectively masked to form solder dams. The high temperature, thick-film solder dams define the bonding area and control the flow of solder. Since the solder dam forms a finite-extent structure, the solder mask minimally overlies the signal trace, and signal propagation through the trace is not degraded.

摘要翻译： 已经提供了一种接口，以允许在适合于微波到毫米波频率的衬底之间形成焊料连接。 具体地说，衬底上的信号迹线被选择性地屏蔽以形成焊料坝。 高温，厚膜焊接坝定义了焊接区域并控制了焊料的流动。 由于焊料坝形成有限范围的结构，所以焊接掩模最小地覆盖在信号迹线上，并且通过迹线的信号传播不会降低。

公开(公告)号：US06433650B1

公开(公告)日：2002-08-13

申请号：US09597988

申请日：2000-06-19

申请人： Thomas Harju ,  Björn Albinsson

发明人： Thomas Harju ,  Björn Albinsson

IPC分类号： H01P308

CPC分类号： H01P3/081 ,  H01P1/047 ,  H01P5/028 ,  H05K1/0251 ,  H05K1/0298 ,  H05K2201/093 ,  H05K2201/09672 ,  H05K2201/09845

摘要： The invention relates to an electrical transmission arrangement comprising a first section of a conductor with a main extension in a first and a second plane, and a first section of a ground plane which extends essentially in parallel with the first conductor section on a first side thereof, at a certain first distance therefrom and has a main extension in the same two planes as the first conductor section, which first conductor section and first ground plane section together are included in a microstrip arrangement, and a second section of the same conductor, a second and a third ground plane section, where the second and third ground plane sections extend essentially in parallel with the second conductor section on a first and, respectively, second side thereof at a second and, respectively, third distance therefrom, where the second conductor section and the second and third ground plane sections are included in a strip-line arrangement, in which transmission arrangement the conductor sections are separated from adjacent ground plane sections by a dielectric medium. The first and the second conductor sections are displaced in parallel with respect to one another along a third plane and exhibit an electrical connection to one another, and the ground plane sections are displaced in parallel with respect to one another along the same plane as the displacements of the conductor sections.

摘要翻译： 本发明涉及一种电气传输装置，其包括在第一和第二平面中具有主延伸部的导体的第一部分和在第一侧面上与第一导体部分基本上平行延伸的接地平面的第一部分 在与第一导体部分相同的两个平面中具有主延伸部，第一导体部分和第一接地平面部分一起包括在微带布置中，第二部分具有相同的导体， 第二和第三接地平面部分，其中第二和第三接地平面部分在与第二导体部分基本上平行于第一和第二侧上的第二和第二侧上延伸，第二和第二侧分别与第二导体部分 截面和第二和第三接地平面段包括在带状布置中，其中传动装置的行为 或者通过电介质与相邻的接地平面部分分开。 第一和第二导体部分沿着第三平面相对于彼此平行移位并且彼此呈现电连接，并且接地平面部分沿着与位移相同的平面相对于彼此平行地移位 的导体部分。

公开(公告)号：US06377142B1

公开(公告)日：2002-04-23

申请号：US09419047

申请日：1999-10-15

申请人： Luna H. Chiu ,  Yongfei Zhu ,  Xubai Zhang ,  Steven C. Stowell ,  Andrey Kozyrev ,  Somnath Sengupta ,  Louise Sengupta

发明人： Luna H. Chiu ,  Yongfei Zhu ,  Xubai Zhang ,  Steven C. Stowell ,  Andrey Kozyrev ,  Somnath Sengupta ,  Louise Sengupta

IPC分类号： H01P308

CPC分类号： H05K1/162 ,  H01P1/181 ,  H01P3/003 ,  H01P3/06 ,  H01P3/081 ,  H01P3/088 ,  H01P3/122 ,  H01P7/06 ,  H01Q3/44 ,  H05K1/024 ,  H05K2201/0187 ,  H05K2201/037 ,  H05K2203/105 ,  H05K2203/171

摘要： A tunable dielectric structure includes a first layer of dielectric material, a second layer of dielectric material positioned adjacent to the first layer of dielectric material, with the second layer of dielectric material having a dielectric constant that is less than the dielectric constant of the first layer of dielectric material, and electrodes for applying a controllable voltage across the first dielectric material, thereby controlling a dielectric constant of the first dielectric material, wherein at least one of the electrodes is positioned between the first and second layers of dielectric material. The dielectric materials can be formed in various shapes and assembled in various orientations with respect to each other. The tunable dielectric structure is used in various devices including a coaxial cables, cavity antenna, microstrip lines, coplanar lines, and waveguides.

摘要翻译： 可调电介质结构包括第一介电材料层，邻近第一介电材料层定位的第二介电材料层，第二介电材料层的介电常数小于第一层的介电常数 以及用于在第一介电材料上施加可控电压的电极，从而控制第一介电材料的介电常数，其中至少一个电极位于第一和第二介电层之间。 介电材料可以形成为各种形状并且以各种取向相对于彼此组装。 可调电介质结构用于包括同轴电缆，空腔天线，微带线，共面线和波导的各种装置中。