公开(公告)号：US20230207480A1

公开(公告)日：2023-06-29

申请号：US17561553

申请日：2021-12-23

Applicant: Omkar KARHADE ,  Nitin A. DESHPANDE

Inventor： Omkar KARHADE ,  Nitin A. DESHPANDE

IPC: H01L23/544 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L23/544 ,  H01L23/49524 ,  H01L23/49582 ,  H01L24/08 ,  H01L2223/54426 ,  H01L2224/08145

Abstract: Embodiments disclosed herein include semiconductor devices. In an embodiment, a die comprises a substrate, where the substrate comprises a semiconductor material. In an embodiment a fiducial is on the substrate. In an embodiment, the fiducial is a cantilever beam that extends out past an edge of the substrate.