公开(公告)号：US20240089639A1

公开(公告)日：2024-03-14

申请号：US17940872

申请日：2022-09-08

Applicant: OmniVision Technologies, Inc.

Inventor： Liang ZUO ,  Zhenfu TIAN ,  Jiayu GUO ,  Dennis LEE ,  Zhiqiang SONG

IPC: H04N5/369 ,  H04N5/367 ,  H04N5/378

CPC classification number: H04N5/379 ,  H04N5/367 ,  H04N5/378

Abstract: A global shutter image sensor with improved pixel failure coverage detects failures caused by the pixel chip of the image sensor. The global shutter image sensor includes a pixel chip including an array of photodiodes and associated logic, and a logic chip, bonded to the pixel chip, including an array of logic blocks for processing the images detected by the photodiodes. A failure detection circuit coupled to a reference voltage node of the image sensor detects a failure in the pixel chip by capturing a first level of pixel bias current and a second level of pixel bias current wherein a difference between the first level and the second level drives an output of the failure detection circuit either as logic high or as logic low.