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公开(公告)号:US20240089639A1
公开(公告)日:2024-03-14
申请号:US17940872
申请日:2022-09-08
Applicant: OmniVision Technologies, Inc.
Inventor: Liang ZUO , Zhenfu TIAN , Jiayu GUO , Dennis LEE , Zhiqiang SONG
Abstract: A global shutter image sensor with improved pixel failure coverage detects failures caused by the pixel chip of the image sensor. The global shutter image sensor includes a pixel chip including an array of photodiodes and associated logic, and a logic chip, bonded to the pixel chip, including an array of logic blocks for processing the images detected by the photodiodes. A failure detection circuit coupled to a reference voltage node of the image sensor detects a failure in the pixel chip by capturing a first level of pixel bias current and a second level of pixel bias current wherein a difference between the first level and the second level drives an output of the failure detection circuit either as logic high or as logic low.
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公开(公告)号:US20230311859A1
公开(公告)日:2023-10-05
申请号:US17711836
申请日:2022-04-01
Applicant: OmniVision Technologies, Inc.
Inventor: Zhenfu TIAN , Liang ZUO , Yan LI , Wen HE , Satoshi SAKURAI
IPC: B60W30/09 , B60W50/14 , G01S13/931
CPC classification number: B60W30/09 , B60W50/14 , G01S13/931 , B60W2420/42
Abstract: A failure detection circuit for an image sensor includes a first input node, an array of second input nodes, and an output stage. The first input node is coupled to a reference voltage. The array of second input nodes has each input node coupled to receive a signal from a bitline of a bitline array in an image sensor that includes an array of pixels with each pixel is coupled to at least one bitline of the bitline array. The output stage is coupled to generate an output voltage indicative of any of the second input nodes being lower than the reference voltage.
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