公开(公告)号：US20230247330A1

公开(公告)日：2023-08-03

申请号：US17592389

申请日：2022-02-03

Applicant: OmniVision Technologies, Inc.

Inventor： Selcuk SEN ,  Liang ZUO ,  Rui WANG ,  Xuelian LIU ,  Min QU ,  Hiroaki EBIHARA

IPC: H04N5/359 ,  H01L27/146 ,  H04N5/374

CPC classification number: H04N5/3594 ,  H01L27/14643 ,  H01L27/14609 ,  H04N5/374

Abstract: In an embodiment, a method of reducing resistance-capacitance delay along photodiode transfer lines of an image sensor includes forking a plurality of photodiode transfer lines each into a plurality of sublines coupled together and to a first decoder-driver at a first end of each subline; and distributing selection transistors of a plurality of multiple-photodiode cells among the plurality of sublines. In embodiments, the sublines may be recombined at a second end of the sublines and driven by a second decoder-driver at the second end.

公开(公告)号：US20180220095A1

公开(公告)日：2018-08-02

申请号：US15421911

申请日：2017-02-01

Applicant: OmniVision Technologies, Inc.

Inventor： Rui WANG ,  Hiroaki EBIHARA ,  Zheng YANG ,  Chun-Ming TANG ,  Chao-Fang TSAI ,  Tiejun DAI

IPC: H04N5/378 ,  H01L27/146 ,  H04N5/374

CPC classification number: H01L27/14641 ,  H01L27/14612 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14643 ,  H04N5/3745 ,  H04N5/37457 ,  H04N5/379

Abstract: A hybrid-bonded image sensor has a photodiode die with multiple macrocells; each macrocell has at least one photodiode and a coupling region. The coupling regions couple to a coupling region of a macrocell unit of a supporting circuitry die where they feed an input of an amplifier and a feedback capacitor. The feedback capacitor also couples to output of the amplifier, and the amplifier inverts between the input and the output. The method includes resetting a photodiode of the photodiode die; coupling signal from photodiode through the bond point to the supporting circuitry die to a feedback capacitor and to an input of the amplifier, the feedback capacitor also coupled to an inverting output of the amplifier; and amplifying the signal with the amplifier, where a capacitance of the feedback capacitor determines a gain of the amplifier.

公开(公告)号：US20180220094A1

公开(公告)日：2018-08-02

申请号：US15421881

申请日：2017-02-01

Applicant: OmniVision Technologies, Inc.

Inventor： Zheng YANG ,  Hiroaki EBIHARA ,  Chun-Ming TANG ,  Chao-Fang TSAI ,  Rui WANG ,  Tiejun DAI

IPC: H04N5/378 ,  H01L27/146 ,  H04N5/374

CPC classification number: H04N5/378 ,  H01L27/14612 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14643 ,  H04N5/374 ,  H04N5/37457 ,  H04N5/379

Abstract: A hybrid bonded image sensor has a photodiode die with macrocells having at least one photodiode and a bond contact; a supporting circuitry die with multiple supercells, each supercell having at least one macrocell unit having a bond contact coupled to the bond contact of a macrocell of the photodiode die. Each macrocell unit lies within a supercell and has a reset transistor adapted to reset photodiodes of the macrocell of the photodiode die. Each supercell has at least one common source amplifier adapted to receive signal from the bond contact of a selected macrocell unit of the supercell, the common source amplifier coupled to drive a column line through a selectable source follower. In embodiments, the common source amplifiers of several supercells drive the selectable source follower through a distributed differential amplifier.