公开(公告)号：US20150318325A1

公开(公告)日：2015-11-05

申请号：US14270281

申请日：2014-05-05

Applicant: OmniVision Technologies, Inc.

Inventor： Edward Nabighian ,  Yi Quin ,  Ward Zhang ,  Alan Martin

IPC: H01L27/146

CPC classification number: H01L27/14685 ,  H01L27/1462 ,  H01L27/14687

Abstract: A method for black coating camera cubes at wafer level includes expanding the gap between individual diced camera cubes of the wafer by stretching tape securing the diced camera cubes. The method includes applying a black coating layer to the stretched camera cubes, laser trimming undesired portions of the black coating layer, and removing the undesired portions of the black coating layer.

Abstract translation: 用于在晶片级黑色涂布相机立方体的方法包括通过固定切割的相机立方体的拉伸带扩大晶片的各个切割相机立方体之间的间隙。 该方法包括将黑色涂层施加到拉伸的相机立方体上，激光修整黑色涂层的不希望的部分，以及去除黑色涂层的不希望的部分。