公开(公告)号：US20190013279A1

公开(公告)日：2019-01-10

申请号：US15642132

申请日：2017-07-05

Applicant: OmniVision Technologies, Inc.

Inventor： Ying-Chih KUO ,  Ying CHUNG

IPC: H01L23/00 ,  H01L27/146

Abstract: A delamination-resistant semiconductor device includes a conductive layer, a semiconductor layer, and a spacer. The conductive layer has a first side opposite a second side. The semiconductor layer is on the first side and defines an aperture therethrough spanned by the conductive layer. The spacer is on the second side and has a top surface, proximate the conductive layer, that defines a blind hole spanned by the conductive layer. A method for preventing delamination of a multilayer structure, includes a step of disposing a first layer on a substrate such that the first layer spans an aperture of the substrate. The method also includes a step of disposing a second layer on the first layer. The second layer has a blind hole adjacent to the first layer such that the first layer spans the blind hole.

公开(公告)号：US20210111220A1

公开(公告)日：2021-04-15

申请号：US16600180

申请日：2019-10-11

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng CHEN ,  Wei-Ping CHEN ,  Ying CHUNG ,  Chen-Yu HUNG

IPC: H01L27/146

Abstract: A method for manufacturing light-shielded cameras includes forming a plurality of camera dies by dicing a camera wafer stack including (a) an image sensor wafer having a plurality of image sensors, (b) a cover glass bonded to the image sensor wafer, and (c) a lens wafer bonded to the cover glass and having a plurality of lenses, to form a plurality of camera dies. The method further includes, prior to the step of dicing, (i) from a first side of the image sensor wafer facing away from the cover glass and at least partly covered by an opaque layer, pre-cutting a sensor-cover wafer stack that includes the image sensor wafer and the cover glass, and (ii) depositing an opaque material in the pre-cuts. The method also includes, after the step of dicing, applying an opaque coating to second-side surfaces, of the camera dies, formed by the step of dicing.