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公开(公告)号：US20220350983A1
公开(公告)日：2022-11-03
申请号：US17243176
申请日：2021-04-28
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei WAN , Wei-Ping CHEN
IPC: G06K9/00 , G02B13/14 , G02F1/1335
Abstract: An optical fingerprint sensor (OFPS) for use with a liquid-crystal display (LCD) panel having a backlight module is positioned under the backlight module and captures an image of a fingerprint sensing area on the LCD panel through an aperture in both a reflector and a metal shield of the backlight module. The OFPS includes a sensor layer, a wafer-level optic layer bonded to the sensor layer and an infrared pass filter (IRPF) coating formed on a substantially flat top surface of the wafer-level optic layer. An OFPS may be formed with a flat top and may include a wafer-level optic layer having one or more lenses to direct light generated by a light source beneath the wafer-level optic layer. The wafer-level lenses may be bonded with the fingerprint scanner. The flat top of the OFPS may be made with an IRPF coating.
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公开(公告)号：US20210111220A1
公开(公告)日：2021-04-15
申请号：US16600180
申请日：2019-10-11
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng CHEN , Wei-Ping CHEN , Ying CHUNG , Chen-Yu HUNG
IPC: H01L27/146
Abstract: A method for manufacturing light-shielded cameras includes forming a plurality of camera dies by dicing a camera wafer stack including (a) an image sensor wafer having a plurality of image sensors, (b) a cover glass bonded to the image sensor wafer, and (c) a lens wafer bonded to the cover glass and having a plurality of lenses, to form a plurality of camera dies. The method further includes, prior to the step of dicing, (i) from a first side of the image sensor wafer facing away from the cover glass and at least partly covered by an opaque layer, pre-cutting a sensor-cover wafer stack that includes the image sensor wafer and the cover glass, and (ii) depositing an opaque material in the pre-cuts. The method also includes, after the step of dicing, applying an opaque coating to second-side surfaces, of the camera dies, formed by the step of dicing.
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3.发明申请公开(公告)号：US20220230011A1
公开(公告)日：2022-07-21
申请号：US17150827
申请日：2021-01-15
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei WAN , Wei-Ping CHEN , Jau-Jan DENG , Kuang-ju WANG
Abstract: A multiple-lens optical fingerprint reader for reading fingerprints through a display has an image sensor integrated circuit with photosensor array(s); a spacer; and multiple lenses in a microlens array, each lens of multiple lenses focuses light arriving at that lens from a finger adjacent the display through the spacer to form an image on associated photosensors on a photosensor array of the integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the fingerprint through arrayed microlenses onto a photosensor array of an integrated circuit, reading the array to overlapping electronic fingerprint images; extracting features from the overlapping electronic fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.
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4.发明公开公开(公告)号：US20240242531A1
公开(公告)日：2024-07-18
申请号：US18622722
申请日：2024-03-29
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei WAN , Wei-Ping CHEN , Jau-Jan DENG , Kuang-ju WANG
CPC classification number: G06V40/1318 , G02B3/0037 , G02B5/003 , G06V40/1347 , G06V40/1365
Abstract: A multiple-lens optical fingerprint reader for reading fingerprints through a display has an image sensor integrated circuit with photosensor array(s); a spacer; and multiple lenses in a microlens array, each lens of multiple lenses focuses light arriving at that lens from a finger adjacent the display through the spacer to form an image on associated photosensors on a photosensor array of the integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the fingerprint through arrayed microlenses onto a photosensor array of an integrated circuit, reading the array to overlapping electronic fingerprint images; extracting features from the overlapping electronic fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.
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公开(公告)号：US20230122722A1
公开(公告)日：2023-04-20
申请号：US17504105
申请日：2021-10-18
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng CHEN , Wei-Ping CHEN , Jau-Jan DENG , Wei-Feng LIN , Chun-Sheng FAN
Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
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Patent Agency Ranking
公开(公告)号：US20210103159A1
公开(公告)日：2021-04-08
申请号：US16594534
申请日：2019-10-07
Applicant: OmniVision Technologies, Inc.
Inventor： Shih-Hsin HSU , Jau-Jan DENG , Wei-Ping CHEN
Abstract: A passive speckle-suppressing diffuser includes a microlens array for diffusing a light field originating from one or more coherent light beams, and a diffractive optical element mounted in series with the microlens array and having a pixelated thickness distribution, characterized by a spatial variation across the diffractive optical element, to impose a spatially varying phase shift on the light field. The pixelated thickness distribution may be configured such that the spatially varying phase shift suppresses speckle of the light field while minimizing introduction of distinct diffraction structure. A method for passive speckle-suppressing diffusion a light field originating from one or more coherent light beams may include refracting the light field, through a microlens array, to diffuse the light field, and imposing a spatially varying phase shift on the light field to decohere the light field without introducing any first-order diffraction components deflected beyond angle spread introduced by the microlens array.
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公开(公告)号：US20240236465A1
公开(公告)日：2024-07-11
申请号：US18095401
申请日：2023-01-10
Applicant: OmniVision Technologies, Inc.
Inventor： I-Lung LU , Jau-Jan DENG , Wei-Ping CHEN
Abstract: A self-illuminating camera includes a camera and an illuminator. The camera includes an image sensor and a first lens of a pair of two identical lenses. The illuminator is adjacent to the camera and includes a light source and a second lens of the pair of two identical lenses. The illuminator has a field of illumination that at least partially overlaps a field of view of the camera.
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公开(公告)号：US20230351798A1
公开(公告)日：2023-11-02
申请号：US17730688
申请日：2022-04-27
Applicant: OmniVision Technologies, Inc.
Inventor： Tsung-Wei WAN , Wei-Ping CHEN , Jau-Jan DENG
IPC: G06V40/13 , G02B3/00 , H01L27/146
CPC classification number: G06V40/1318 , G02B3/0037 , H01L27/1462 , H01L27/14623 , H01L27/14627 , H01L27/14678 , H01L27/14685 , H01L27/14698
Abstract: A fingerprint sensor has an array of microlenses formed on an upper surface of a transparent substrate; with a lower surface of the transparent substrate bonded to an upper surface of a fingerprint image sensor integrated circuit. In embodiments, it includes one or two filter layers on the lower surface of the transparent substrate, and may also include masked black baffle layers on one or more of the upper and lower surface of the transparent substrate. The sensor is made by forming the microlenses and black baffle layers on the transparent substrate, then aligning the transparent substrate to a wafer of fingerprint sensor integrated circuits and bonding the transparent substrate to the wafer, then dicing the wafer into individual fingerprint sensors.
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公开(公告)号：US20230262310A1
公开(公告)日：2023-08-17
申请号：US17674675
申请日：2022-02-17
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng CHEN , Wei-Ping CHEN , Jau-Jan DENG , Wei-Feng LIN
IPC: H04N5/225
CPC classification number: H04N5/2256 , H04N5/2257 , H04N5/2254
Abstract: An electronic camera assembly includes a camera chip cube bonded to camera bondpads of an interposer; at least one light-emitting diode (LED) bonded to LED bondpads of the interposer at the same height as the camera bondpads; and a housing extending from the interposer and LEDs to the height of the camera chip cube, with light guides extending from the LEDs through the housing to a top of the housing. In embodiments, the electronic camera assembly includes a cable coupled to the interposer. In typical embodiments the camera chip cube has footprint dimensions of less than three and a half millimeters square.
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公开(公告)号：US20230118866A1
公开(公告)日：2023-04-20
申请号：US17747803
申请日：2022-05-18
Applicant: OmniVision Technologies, Inc.
Inventor： Teng-Sheng CHEN , Wei-Ping CHEN , Wei-Feng LIN , Jau-Jan DENG
Abstract: A cavity interposer has a cavity, first bondpads adapted to couple to a chip-type camera cube disposed within a base of the cavity at a first level, the first bondpads coupled through feedthroughs to second bondpads at a base of the interposer at a second level; and third bondpads adapted to couple to a light-emitting diode (LED), the third bondpads at a third level. The third bondpads coupled to fourth bondpads at the base of the interposer at the second level; and the second and fourth bondpads couple to conductors of a cable with the first, second, and third level different. An endoscope optical includes the cavity interposer an LED, and a chip-type camera cube electrically bonded to the first bondpads; the LED is bonded to the third bondpads; and a top of the chip-type camera cube and a top of the LED are at a same level.
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