公开(公告)号：US20230329880A1

公开(公告)日：2023-10-19

申请号：US18207253

申请日：2023-06-08

Applicant: Orthosensor Inc.

Inventor： Glenn Monroe ,  Wael Hazin ,  Matthias Verstraete

IPC: A61F2/46 ,  A61B5/00 ,  A61B5/06

CPC classification number: A61F2/4657 ,  A61B5/4528 ,  A61B5/6878 ,  A61B5/062 ,  A61F2002/4666

Abstract: Disclosed herein joint implants with sensors and methods for activating sensors in joint implants. A joint implant according to the present disclosure can include a first implant on a first bone and a second implant on a second bone of a joint. The first implant can include a magnet. The second implant can include one or more sensors, a processor, a battery, and a switch. The switch can couple the battery to the processor to power the processor and the one or more sensors when the switch detects a magnetic field strength.