公开(公告)号：US11855245B2

公开(公告)日：2023-12-26

申请号：US17275675

申请日：2019-09-12

Applicant: Osram OLED GmbH

Inventor： Korbinian Perzlmaier ,  Alexander F. Pfeuffer ,  Kerstin Neveling

IPC: H01L33/62 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L33/382

Abstract: An optoelectronic semiconductor element may include an optoelectronic semiconductor chip. The optoelectronic semiconductor chip may include a first semiconductor layer of a first conductivity type, a second semiconductor layer of a second conductivity type, a first contact element connected to the first semiconductor layer in an electrically conductive manner, and a second contact element connected to the second semiconductor layer in an electrically conductive manner. The first semiconductor layer and the second semiconductor layer are arranged one above the other to form a layer stack. The first semiconductor layer to where the second semiconductor layer is exposed. The first contact element is arranged over the first semiconductor layer, and the second contact element is arranged over the first semiconductor layer.