公开(公告)号：US20190119526A1

公开(公告)日：2019-04-25

申请号：US16093061

申请日：2017-09-22

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Haruka NISHIKAWA ,  Toshiyuki IEDA ,  Atsushi NAGAI ,  Kazuya SHIMADA

IPC: C09G1/04 ,  C03C15/00

Abstract: An occurrence of a dimple during glass polishing is suppressed by scraping a fine scratch that will become the dimple to be grown in a pre-polishing, followed by main polishing. However, at a mark of the dimple in which the growth thereof is suppressed in the pre-polishing, fine roughening of a surface is generated. Further, a polishing liquid containing hydrofluoric acid, an alkali metal, water, and a surfactant that is a sulfonic acid-type or sulfate-type surfactant can suppress excess crystal growth of a deposit formed in a fine scratch in pre-polishing and suppress roughening of a surface after polishing.