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公开(公告)号:US20190119526A1
公开(公告)日:2019-04-25
申请号:US16093061
申请日:2017-09-22
Inventor: Haruka NISHIKAWA , Toshiyuki IEDA , Atsushi NAGAI , Kazuya SHIMADA
Abstract: An occurrence of a dimple during glass polishing is suppressed by scraping a fine scratch that will become the dimple to be grown in a pre-polishing, followed by main polishing. However, at a mark of the dimple in which the growth thereof is suppressed in the pre-polishing, fine roughening of a surface is generated. Further, a polishing liquid containing hydrofluoric acid, an alkali metal, water, and a surfactant that is a sulfonic acid-type or sulfate-type surfactant can suppress excess crystal growth of a deposit formed in a fine scratch in pre-polishing and suppress roughening of a surface after polishing.
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公开(公告)号:US20180362897A1
公开(公告)日:2018-12-20
申请号:US15781421
申请日:2015-06-16
Inventor: Haruka NISHIKAWA , Toshiyuki IEDA , Kazuya SHIMADA
Abstract: When an alkali-free glass is polished with a polishing liquid containing hydrofluoric acid as a main component, a sludge is generated on a glass surface and in a storage unit and a pipe of a polishing device. As a result, there arise problems such as deterioration of quality and stopping of the device. A washing liquid that dissolves a sludge containing aluminum and fluorine produced in a glass polishing device is characterized by containing Al3+ ions, and a sludge formed by bonding a divalent element such as Mg, Ca, Sr, and Ba with Al and F can be dissolved with this washing liquid. The problems are solved by washing the inside of the polishing device with this washing liquid.
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