公开(公告)号：US09676284B2

公开(公告)日：2017-06-13

申请号：US15303465

申请日：2015-02-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Ryota Tomiyama ,  Maki Kondou ,  Hideki Oka

IPC: B60L11/18 ,  H01R13/56 ,  H01R13/58 ,  H01R13/405 ,  H02J7/00 ,  H01R13/52

CPC classification number: B60L11/1818 ,  B60L11/18 ,  H01R13/405 ,  H01R13/52 ,  H01R13/5202 ,  H01R13/56 ,  H01R13/58 ,  H01R13/5845 ,  H02J7/0045 ,  Y02T10/7005 ,  Y02T90/121

Abstract: The first molded part and the second molded part are molded products of synthetic resin materials. The first molded part is made of a synthetic resin material having a higher creep resistance than a synthetic resin material forming the second molded part. The second molded part is made of a synthetic resin material higher than a synthetic resin material forming the first molded part in adhesion to a material forming the receiver contact.