公开(公告)号：US20160017141A1

公开(公告)日：2016-01-21

申请号：US14771487

申请日：2014-02-27

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Masaaki MATSUMOTO ,  Yasunori HOSHINO ,  Tatsuo YONEMOTO

IPC: C08L65/00 ,  C08J5/24 ,  H05K1/03 ,  C08L63/00 ,  C08L33/08

Abstract: Provided is a resin composition for a printed wiring board with which a substrate material having a low CTE can be formed while ensuring good moldability. A resin composition for a printed wiring board contains a thermosetting resin including an epoxy resin, a curing agent, an inorganic filler, and an expansion relief component including an acrylic resin that is soluble in an organic solvent. The content of the inorganic filler is 150 parts by mass or more with respect to 100 parts by mass of the total amount of the thermosetting resin and the curing agent. The melt viscosity at 130° C. is less than 50000 Ps.

Abstract translation: 提供一种用于印刷线路板的树脂组合物，其中可以形成具有低CTE的基材，同时确保良好的成型性。 用于印刷电路板的树脂组合物含有包含环氧树脂，固化剂，无机填料和包含可溶于有机溶剂的丙烯酸树脂的膨胀释放组分的热固性树脂。 相对于100质量份的热固性树脂和固化剂的总量，无机填料的含量为150质量份以上。 130℃下的熔体粘度小于50000 Ps。