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公开(公告)号：US20200244905A1
公开(公告)日：2020-07-30
申请号：US16852109
申请日：2020-04-17
Inventor： Tsutomu KOBAYASHI , Yuusuke SHIMIZU
Abstract: An imaging device includes: pixels arranged in m rows by n columns; a first comparator that generates a first output signal indicating a result of comparison between a first pixel signal outputted from each pixel located in an ath column among the pixels and a reference signal; a first counter that generates a first digital signal by counting a period from start of a first counting period to inversion of the first output signal; and a first control circuit that determines, in accordance with a magnitude correlation between the first digital signal obtained from a first pixel located at the ath column and a bth row and a threshold, a period in which the first clock signal is supplied to the first counter in the first counting period of a second pixel located at the ath column and a cth row different from the bth row.
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公开(公告)号：US20200059620A1
公开(公告)日：2020-02-20
申请号：US16661854
申请日：2019-10-23
Inventor： Yuusuke SHIMIZU , Kazutoshi ONOZAWA
IPC: H04N5/369 , H01L27/146 , H04N5/3745 , H01L25/065 , H01L23/498
Abstract: A solid-state image capture device includes a first semiconductor substrate and a second semiconductor substrate. The first semiconductor substrate includes a first connection and a pixel array in which a plurality of pixels are arranged in a matrix. The second semiconductor substrate includes a second connection and a pad area including a plurality of pad electrodes for electrical connection with external equipment. The second semiconductor substrate controls the pixel array. The first and second semiconductor substrates are stacked and joined together, with the first and second connections electrically connected to each other. The first and second semiconductor substrates are substantially equal in size, and the pad electrodes are included in only the second semiconductor substrate.
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