公开(公告)号：US20150245497A1

公开(公告)日：2015-08-27

申请号：US14629664

申请日：2015-02-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： lsato IWATA ,  Takuya YAMAZAKI ,  Hirokazu TAKEHARA ,  Hiraki SAGARA

IPC: H05K3/30

CPC classification number: H05K13/0434 ,  H05K13/021 ,  Y10T29/4913 ,  Y10T29/53174

Abstract: Electronic component mounting method for mounting an electronic component on a plurality of board types includes: placing, on tray holding shelves, trays storing components for first and second board types, respectively; recognizing on which tray holding shelf the tray is placed by reading identification information from the trays. The method further includes: rearranging the trays in the tray feeder to a first tray arrangement adapted for the first board type, based on recognized placement position of the tray and the first tray arrangement data, before start of production of the board of the first board type; and rearranging the trays in the tray feeder to a second tray arrangement adapted for the second board type, based on the second tray arrangement data, before start of production of the board of the second board type.

Abstract translation: 用于将电子部件安装在多个板类型上的电子部件安装方法包括：分别在第一和第二板类型的托盘托架上放置托盘存储部件; 通过从托盘中读取识别信息来识别放置托盘的盘托盘。 该方法还包括：在开始制造第一板的板之前，基于所识别的托盘和第一托盘布置数据的放置位置，将托盘馈送器中的托盘重新布置成适合于第一板类型的第一托盘布置 类型; 以及在所述第二板类型的所述板的制造开始之前，基于所述第二托盘布置数据，将所述托盘进料器中的托盘重新布置成适合于所述第二板类型的第二托盘装置。