公开(公告)号：US20220109257A1

公开(公告)日：2022-04-07

申请号：US17401366

申请日：2021-08-13

申请人： PEGATRON CORPORATION

发明人： Yung-Tai Lee ,  Kai-Wen Lee ,  Tse-Hao Yang ,  Yen-Yen Chiu

IPC分类号： H01R12/70 ,  H01B17/30 ,  H01B17/62 ,  H01B17/20 ,  H01R43/02

摘要： Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.

公开(公告)号：US11735843B2

公开(公告)日：2023-08-22

申请号：US17401366

申请日：2021-08-13

申请人： PEGATRON CORPORATION

发明人： Yung-Tai Lee ,  Kai-Wen Lee ,  Tse-Hao Yang ,  Yen-Yen Chiu

IPC分类号： H01R12/70 ,  H01B17/30 ,  H01B17/20 ,  H01R43/02 ,  H01B17/62

CPC分类号： H01R12/7011 ,  H01B17/20 ,  H01B17/305 ,  H01B17/62 ,  H01R43/0256 ,  H01R2201/00

摘要： Provided are a connector and a manufacturing method thereof. The connector is configured to dispose on a circuit board including a mounting hole. The connector includes a guide pin module and a conductive cover. The guide pin module is located on one side of the circuit board and includes a base, a metal guide pin, and a glass sealing layer. The base has a perforation hole corresponding to the mounting hole. The metal guide pin is inserted into the perforation hole and the mounting hole. The glass sealing layer is disposed at the perforation hole and wraps around part of the metal guide pin. The conductive cover is disposed at the mounting hole, connected to the top of the metal guide pin, and protrudes from the circuit board. The conductive cover is bonded to the circuit board by soldering to electrically connect the metal guide pin to the circuit board.