公开(公告)号：US12100910B2

公开(公告)日：2024-09-24

申请号：US17457737

申请日：2021-12-06

申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION

发明人： Theron Lee Lewis ,  David J. Braun ,  James D. Bielick ,  John R. Dangler ,  Timothy P. Younger ,  Timothy Jennings ,  Jennifer I. Bennett ,  Stephen Michael Hugo

IPC分类号： H01R13/516 ,  H01R12/57 ,  H01R43/02

CPC分类号： H01R13/516 ,  H01R43/0256 ,  F16B2200/77 ,  H01R12/57

摘要： A first apparatus includes an electrical connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The first apparatus further includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with an area on the inner wafer. A second apparatus includes an OTS connector with an outer shell and an inner wafer, where the inner wafer is configured to slide into a cavity of the outer shell. The second apparatus further includes a plurality of SMT leads of the inner wafer configured to mount onto a plurality of landing pads on a PCBA. The second apparatus includes a shape-memory alloy coupled to a void in the outer shell and configured to interfere with the inner wafer preventing movement of the inner wafer within the outer shell of OTS connector.

公开(公告)号：US12068554B2

公开(公告)日：2024-08-20

申请号：US17587818

申请日：2022-01-28

申请人： Hewlett Packard Enterprise Development LP

发明人： Paul Danna ,  Vincent W. Michna ,  Chi Kim Sides

IPC分类号： H05K3/34 ,  H01R12/70 ,  H01R12/71 ,  H01R43/02

CPC分类号： H01R12/716 ,  H01R12/707 ,  H01R43/0256 ,  H05K3/3405

摘要： A dual-path signal interconnect is provided. The interconnect can include a first signal trace, first and second solder pads positioned above and connected to the first signal trace, and a third solder pad. The second solder pad separates from the first solder pad. The third solder pad separates from the second solder pad and is connected to a second signal trace. The first and second solder pads are to allow a pin of a connector to be soldered to the first and second solder pads, such that, when the pin of the external connector is soldered, high-speed electrical signals from the first signal trace are routed to the connector. The second and third solder pads are to allow a conductor to be soldered to the second and third solder pads, such that, when the conductor is soldered, the high-speed electrical signals are routed to the second signal trace.

公开(公告)号：US12046860B2

公开(公告)日：2024-07-23

申请号：US17308151

申请日：2021-05-05

申请人： OLYMPUS CORPORATION

发明人： Mikio Nakamura ,  Hiroaki Shibuya ,  Takanori Sekido

IPC分类号： H01R43/02 ,  B23K20/10 ,  H01R4/02 ,  H01R12/53 ,  H01R12/57

CPC分类号： H01R4/021 ,  H01R12/53 ,  H01R12/57 ,  H01R43/02 ,  H01R43/0207 ,  B23K20/10 ,  H01R43/0256 ,  Y10T29/49174 ,  Y10T29/49181 ,  Y10T29/49183 ,  Y10T29/49185

摘要： A cable connection structure manufacturing method includes: covering, by a first electrode, an end face of an electric cable, and covering, by a second electrode, a terminal of a substrate; plastically deforming the first electrode and the second electrode having substantially same hardness by first scrubbing in which the first electrode and the second electrode rub against each other at a first pressure and a first amplitude; polishing the first electrode and the second electrode by second scrubbing in which the first electrode and the second electrode rub against each other at a second pressure smaller than the first pressure and a second amplitude smaller than the first amplitude; and bonding the first electrode and the second electrode at a third pressure higher than the first pressure.

公开(公告)号：US20230335927A1

公开(公告)日：2023-10-19

申请号：US17719755

申请日：2022-04-13

申请人： Raytheon Company

发明人： Sara Lorene Simbeck ,  Glenn Arthur Gage ,  Roy Emerson Martin, III

IPC分类号： H01R12/57 ,  H01R43/02 ,  H05K1/18

CPC分类号： H01R12/57 ,  H01R43/0256 ,  H05K1/181 ,  H01R4/182

摘要： An electrical interconnect including slotted lug with a receiving end for connecting to a flat electrical conductor and a fastening end for connecting to a surface mount terminal extending from the surface of a circuit, such as an integrated metal substrate (IMS) circuit board or a circuit card assembly. The interconnect provides a secure connection capable of transmitting a current of at least 100 Arms, to give a non-limiting example value. The interconnect further provides low contact resistance and ease of manufacturing.

公开(公告)号：US11764522B2

公开(公告)日：2023-09-19

申请号：US17216463

申请日：2021-03-29

申请人： Amphenol East Asia Ltd.

发明人： Wen Te (Hank) Hsu ,  Sheng-Fen Sang

IPC分类号： H01R13/648 ,  H01R13/6581 ,  H01R13/6594 ,  H01R12/70 ,  H01R43/02 ,  H01R13/631 ,  H01R12/72 ,  H01R13/627 ,  H01R12/71 ,  H01R13/502 ,  H01R43/20

CPC分类号： H01R13/6581 ,  H01R12/707 ,  H01R12/7052 ,  H01R12/716 ,  H01R12/724 ,  H01R12/727 ,  H01R13/502 ,  H01R13/6273 ,  H01R13/631 ,  H01R13/6594 ,  H01R43/0256 ,  H01R43/20

摘要： A receptacle connector having a plurality of airflow holes positioned to avoid heat buildup inside a receptacle shell, preventing deformation to the housing of a short, high density connector during solder reflow. The airflow holes may be in a bent portion joining a top face and rear face of the shell. The receptacle connector may be mounted to a substrate, such as a printed circuit board, leaving a gap between the connector and the substrate, forming an airflow passage between the substrate and the receptacle connector, enabling heated air to reach mounting portions of terminals of the connector during soldering, but reducing heat buildup within the shell. The passage, alone or in combination with a cutout in a face of the shell, may expose terminal contacts of the receptacle connector to provide for easy inspection and rework of the solder joints between the terminal contacts and the substrate.

公开(公告)号：US11757223B2

公开(公告)日：2023-09-12

申请号：US17230712

申请日：2021-04-14

申请人： Dell Products L.P.

发明人： Isaac Q. Wang ,  Timothy M. Lambert ,  Corey D. Hartman

IPC分类号： H01R25/16 ,  H01R12/73 ,  H01R12/57 ,  H01R27/02 ,  H05K1/18 ,  H01R43/02 ,  H01R43/20

CPC分类号： H01R12/737 ,  H01R12/57 ,  H01R27/02 ,  H01R43/0256 ,  H01R43/20 ,  H05K1/181 ,  H05K2201/0999 ,  H05K2201/10189 ,  H05K2201/10492 ,  H05K2201/10522

摘要： An information handling system may include a printed circuit board and a plurality of connectors each electrically and mechanically coupled to the printed circuit board, each connector of the plurality of connectors configured to receive a respective modular information handling resource in order to electrically couple, via electrically-conductive pins of such connector, the respective modular information handling resource to the printed circuit board. Each connector may include a body comprising electrically non-conductive material and including a receptacle formed therein for receiving a mating edge connector of the respective modular information handling resource, a bus bar comprising electrically conductive material, other than the electrically-conductive pins of such connector, disposed within or upon the body and extending through at least a portion of the body, and an electrical termination electrically coupled to the bus bar.

公开(公告)号：US20230253748A1

公开(公告)日：2023-08-10

申请号：US17667042

申请日：2022-02-08

申请人： e-con Systems India Private Limited

发明人： Deepan Chakravarthi N

IPC分类号： H01R43/02 ,  H01R12/57 ,  B23K1/00

CPC分类号： H01R43/0263 ,  B23K1/0016 ,  H01R12/57 ,  H01R43/0256 ,  H01R12/716

摘要： The present invention relates to a PCB connector with SMT adhesive agent (102). The present invention further relates to a method to rigidly hold a connector housing (101) on a printed circuit board assembly, which comprises a connector housing (101) which is to be fixed to the printed circuit board during the PCB assembly process using the SMT adhesive agent (102). The primary advantage is a reliable board-to-board stacking connector assembly.

公开(公告)号：US20230170654A1

公开(公告)日：2023-06-01

申请号：US17922099

申请日：2021-04-12

申请人： AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMO WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

发明人： Pipatthana PHATIWUTTIPAT ,  Kenji MAKINO

IPC分类号： H01R24/60 ,  H01R43/02 ,  H01R13/502

CPC分类号： H01R24/60 ,  H01R43/0256 ,  H01R13/502 ,  H01R2107/00

摘要： A connector is provided with a plurality of terminal fittings (10), a holding member (20) configured such that the plurality of terminal fittings (10) are arranged in parallel therein, a circuit board (90) to which the plurality of terminal fittings (10) are connected, and a housing (50) for holding the holding member (20). The connector is manufactured by successively performing an arranging step of arranging the plurality of terminal fittings (10) in parallel in the holding member (20), a reflow step of reflow-connecting the plurality of terminal fittings (10) to the circuit board (90) and a holding step of holding the holding member (20) in the housing (50).

公开(公告)号：US20190027843A1

公开(公告)日：2019-01-24

申请号：US16081678

申请日：2017-03-02

申请人： Kitagawa Industries Co., Ltd.

发明人： Tatsuya Nakamura ,  Kazushige Ueno

IPC分类号： H01R12/57 ,  H01R13/24 ,  H01R43/02 ,  H01R12/70 ,  H01R4/02

CPC分类号： H01R12/57 ,  H01R4/02 ,  H01R12/707 ,  H01R13/24 ,  H01R43/0256

摘要： The contact includes a base portion, a contact portion, and a spring portion integrally molded with a thin metal plate. The spring portion includes a first bending portion, a flat plate portion, and a second bending portion. The first bending portion is bent such that a first surface of the thin plate is on an outer peripheral side, and the second bending portion is bent such that a second surface of the thin plate is on an outer peripheral side. The thin plate has a thickness t of from 0.10 to 0.15 mm, a curvature radius R1 of the first bending portion is from 0.6 to 1.0 mm, and a ratio L/R1 of a length L between the first bending portion and the second bending portion of the flat plate portion to the curvature radius R1 is configured to satisfy 0

公开(公告)号：US20190006802A1

公开(公告)日：2019-01-03

申请号：US16019850

申请日：2018-06-27

申请人： LOTES CO., LTD.

发明人： Ted Ju ,  Chin Chi Lin

IPC分类号： H01R24/78 ,  H01R43/02 ,  H01R13/66 ,  H01R13/516 ,  H05K7/20

CPC分类号： H01R24/78 ,  G06F1/20 ,  H01R13/46 ,  H01R13/516 ,  H01R13/6658 ,  H01R24/60 ,  H01R43/0256 ,  H05K7/20154 ,  H05K7/2039 ,  H05K7/20918

摘要： An assembly includes: a socket connector, having an insulating seat, multiple mating terminals and a metal shell provided outside the insulating seat; at least one first thermal conduction member located outside the metal shell; and a plug connector, including: a circuit board; at least one chip provided on the circuit board; a mating joint electrically connected to one end of the circuit board and having an insulating body, multiple conductive terminals, and a shielding shell provided outside the insulating body; and at least one second thermal conduction member having a conducting portion thermally conductive with the chip and a protruding portion located outside the shielding shell. When the mating joint is mated with the socket connector, the mating terminals are in contact with the conductive terminals to form an electrical connection, and the protruding portion is in contact with the first thermal conduction member to perform thermal conduction.