公开(公告)号：US20150146364A1

公开(公告)日：2015-05-28

申请号：US14090907

申请日：2013-11-26

申请人： PETER LEEKUO CHOU ,  STEPHEN CHIEN ,  WILLIAM TAI

发明人： PETER LEEKUO CHOU ,  STEPHEN CHIEN ,  WILLIAM TAI

IPC分类号： H05K7/14 ,  H05K5/03

CPC分类号： H05K7/142

摘要： A solid state drive (SSD) assembly and an assembly method for solid state drives, which does not require using screws. The assembly method includes aligning a printed circuit board with a first cover and a second cover, the first cover having pre-installed standoffs on an inner surface thereof. The printed circuit board and the second cover respectively having a first set of through-holes, and the first set of through-holes correspond to the standoffs. The assembly method further includes placing the printed circuit board between the first and second covers, thereby exposing an end portion of each of the standoffs in the through-holes of the second cover, and deforming the end portion of each of the standoffs about the through-holes, thereby fastening the first and second covers with one another.

摘要翻译： 固态驱动器（SSD）组件和用于固态驱动器的组装方法，其不需要使用螺钉。 组装方法包括将印刷电路板与第一盖和第二盖对准，第一盖在其内表面上具有预先安装的间隔。 印刷电路板和第二盖分别具有第一组通孔，第一组通孔对应于支座。 组装方法还包括将印刷电路板放置在第一和第二盖之间，从而将每个支座的端部暴露在第二盖的通孔中，并使每个支座的端部围绕通孔 从而将第一和第二盖彼此紧固。