公开(公告)号：US20250123721A1

公开(公告)日：2025-04-17

申请号：US18990037

申请日：2024-12-20

Applicant: PIXART IMAGING INC.

Inventor： CHE-CHIA HSU ,  CHUN-LIN TSENG ,  YU-HAN CHEN

IPC: G06F3/044

Abstract: A circuit carrier includes a substrate, a capacitive electrode layer, a plurality of metal pads and a plurality of bridges, and a plurality of conductive pillars. The capacitive electrode layer formed on a surface of the substrate and includes a plurality of first electrodes and a plurality of second electrodes. At least two of the first electrodes are connected to each other and be arranged across a die-bonding region of the substrate for separating at least two of the second electrodes that partially protrude from the die-bonding region to respectively form extensions. The metal pads and the bridges are formed on another surface of the substrate and are located outside of the die-bonding region. Each of the bridges connects two of the metal pads, and each of the conductive pillars is embedded in the substrate and connects one of the extensions and a corresponding one of metal pads.

公开(公告)号：US20240288976A1

公开(公告)日：2024-08-29

申请号：US18640087

申请日：2024-04-19

Applicant: PIXART IMAGING INC.

Inventor： CHE-CHIA HSU ,  CHUN-LIN TSENG ,  YU-HAN CHEN

IPC: G06F3/044

CPC classification number: G06F3/0446 ,  G06F2203/04111

Abstract: A circuit carrier includes a substrate, a capacitive electrode layer, a plurality of metal pads and a plurality of bridges, and a plurality of conductive pillars. The capacitive electrode layer formed on a surface of the substrate and includes a plurality of first electrodes and a plurality of second electrodes. At least two of the first electrodes are connected to each other and be arranged across a die-bonding region of the substrate for separating at least two of the second electrodes that partially protrude from the die-bonding region to respectively form extensions. The metal pads and the bridges are formed on another surface of the substrate and are located outside of the die-bonding region. Each of the bridges connects two of the metal pads, and each of the conductive pillars is embedded in the substrate and connects one of the extensions and a corresponding one of metal pads.