公开(公告)号：US20230366730A1

公开(公告)日：2023-11-16

申请号：US18223562

申请日：2023-07-19

Applicant: PIXART IMAGING INC.

Inventor： SAI MUN LEE ,  CHEE PIN T'NG

IPC: G01J1/04 ,  H05K1/18

CPC classification number: G01J1/0407 ,  H05K1/183 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10719

Abstract: The invention provides an optical sensor package. The optical sensor package includes: a substrate; a sensor disposed on the substrate; a glass cover disposed directly on the sensor; and a cap disposed on the substrate comprised of a solid perimeter surrounding the sensor and a ceiling having a cut-out section above the glass cover. The thickness of the cap is 0.20 mm.