Apparatus and method for manufacturing plurality of electronic circuits

    公开(公告)号:US10811383B2

    公开(公告)日:2020-10-20

    申请号:US16075829

    申请日:2017-02-09

    Abstract: A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller; transferring said ICs from the first roller onto a second roller; and transferring said ICs from the second roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

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