公开(公告)号：US10811383B2

公开(公告)日：2020-10-20

申请号：US16075829

申请日：2017-02-09

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Neil Davies ,  Richard David Price ,  Stephen Devenport ,  Stuart Philip Speakman

IPC: H01L23/00

Abstract: A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller; transferring said ICs from the first roller onto a second roller; and transferring said ICs from the second roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

公开(公告)号：US11177145B2

公开(公告)日：2021-11-16

申请号：US16621387

申请日：2018-06-18

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Neil Davies ,  Richard Price ,  Stephen Devenport ,  Stuart Speakman

IPC: H01L21/67 ,  H01L25/00

Abstract: A method of manufacturing a plurality of electronic circuits is disclosed. Each electronic circuit comprises a respective first portion, comprising a respective group of contact pads, and a respective integrated circuit, IC, comprising a respective group of terminals and mounted on the respective group of contact pads with each terminal in electrical contact with a respective contact pad. The method comprises: providing a first structure comprising the plurality of first portions; providing a second structure comprising the plurality of ICs and a common support arranged to support the plurality of ICs; transferring said ICs from the common support onto a first roller having a removable surface portion; and transferring said ICs from the first roller onto the first structure such that each group of terminals is mounted on a respective group of contact pads.

公开(公告)号：US11990484B2

公开(公告)日：2024-05-21

申请号：US17874875

申请日：2022-07-27

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Richard Price ,  Brian Cobb ,  Neil Davies

IPC: H01L21/78 ,  H01L27/12

CPC classification number: H01L27/1262 ,  H01L21/78 ,  H01L27/1218 ,  H01L27/1266

Abstract: The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.

公开(公告)号：US11910533B2

公开(公告)日：2024-02-20

申请号：US17269626

申请日：2019-07-30

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Neil Davies ,  Stephen Devenport ,  Richard Price

IPC: B23K1/00 ,  H05K13/04 ,  H01L21/50 ,  H01L23/00 ,  H05K1/11 ,  H05K3/32 ,  H01L21/60

CPC classification number: H05K13/0469 ,  B23K1/0016 ,  H01L21/50 ,  H01L24/32 ,  H01L24/83 ,  H05K1/118 ,  H05K3/323 ,  H01L2021/60277 ,  H01L2224/32148 ,  H01L2224/83203

Abstract: The invention relates to a thermode for connecting at least two components, comprising a tip having a body portion with at least two contact surface portions connected to and spaced apart from one another by a recess configured to receive a portion of one of the at least two components; and a support portion having at least one supporting surface portion configured to support a further component (being the other of the at least two components, wherein the contact surface portions and the supporting surface portion are configured to receive the at least two components between them and wherein one or both of the contact surface portions and the supporting surface portion are moveable relative to and towards one another to exert heat and/or pressure on the at least two components located between the contact surface portions and the supporting portion.

公开(公告)号：US11462575B2

公开(公告)日：2022-10-04

申请号：US16964513

申请日：2019-01-30

Applicant: PRAGMATIC PRINTING LTD.

Inventor： Richard Price ,  Brian Cobb ,  Neil Davies

IPC: H01L27/12 ,  H01L21/78

Abstract: The present invention provides processes for manufacturing a plurality of discrete integrated circuits (ICs) on a carrier, the process comprising the steps of: providing a carrier for a flexible substrate; depositing a flexible substrate of uniform thickness on said carrier; removing at least a portion of the thickness of the flexible substrate from at least a portion of the IC connecting areas to form channels in the flexible substrate and a plurality of IC substrate units spaced apart from one another on the carrier by said channels; forming an integrated circuit on at least one of the IC substrate units.