Laser processing head, laser processing device, and method for adjusting laser processing head

    公开(公告)号:US11597033B2

    公开(公告)日:2023-03-07

    申请号:US16977420

    申请日:2018-03-23

    Abstract: A laser processing head includes a laser irradiation part, a collimating optical system for collimating laser light from the laser irradiation part, and a collecting optical system for collecting the laser light after passing through the collimating optical system. An optical system including the collimating optical system and the collecting optical system is configured such that the laser light after passing through the collecting optical system has coma aberration. The laser processing head further includes a first moving part for moving at least one of the laser irradiation part or the collimating optical system so as to change a relative position of the collimating optical system with respect to the laser irradiation part, in a first direction orthogonal to a center axis of the laser irradiation part or the collimating optical system, and a second moving part for moving the collecting optical system so as to change a relative position of the collecting optical system with respect to the collimating optical system, in a second direction orthogonal to a center axis of the collecting optical system.

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