公开(公告)号：US20020157612A1

公开(公告)日：2002-10-31

申请号：US10119632

申请日：2002-04-10

申请人： PRINCO CORP.

发明人： Ying-Che Shih ,  Pei-Liang Chiu

IPC分类号： C23C016/00

CPC分类号： C23C14/042

摘要： The present invention discloses a vacuum evaporation apparatus comprising a vacuum pump, an evaporation chamber and a power supply. The evaporation chamber comprises a substrate, an evaporation source and an evaporation mask. The evaporation mask exhibits a coefficient of thermal expansion substantially equal to the substrate, and the evaporation mask has a pattern of metal tracks. Thus, the apparatus of the present invention also can be applied to form solder bumps on a large sized silicon wafer. Moreover, the position pattern of the mask is formed by an anisotropic etching process; the diameter of the pattern will not be influenced by the thickness of the mask. Therefore, the tendency of the solder bumps with the smaller size and the pitch are met.

摘要翻译： 本发明公开了一种包括真空泵，蒸发室和电源的真空蒸发装置。 蒸发室包括基底，蒸发源和蒸发掩模。 蒸发掩模具有基本上等于衬底的热膨胀系数，并且蒸发掩模具有金属轨道的图案。 因此，本发明的装置也可以应用于在大尺寸硅晶片上形成焊料凸块。 此外，掩模的位置图案通过各向异性蚀刻工艺形成; 图案的直径不会受到掩模的厚度的影响。 因此，满足具有较小尺寸和间距的焊料凸块的趋势。