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公开(公告)号：US10132878B2
公开(公告)日：2018-11-20
申请号：US15261114
申请日：2016-09-09
Applicant: PROLIFIC TECHNOLOGY INC.
Inventor： Hung-Ta Li , Po-Feng Lee
Abstract: An electromagnetic impedance sensing device includes a substrate, a first patterned conductive layer, a second patterned conductive layer, a magneto-conductive wire and an encapsulation layer. The substrate has a surface and a trench extending into thereof. The first patterned conductive layer is formed on the surface, as well as a bottom and sidewalls of the trench. The magneto-conductive wire is disposed in the trench. The second patterned conductive layer extending across the trench and electrically in contact with the first patterned conductive layer is formed on the first patterned conductive layer to make the magneto-conductive wire sandwiched between the first and the second patterned conductive layers. The magneto-conductive wire is encapsulated by the encapsulation layer to make the magneto-conductive wire electrically isolated from the first and second patterned conductive layers. At least one coil circuit surrounding the magneto-conductive wire is formed by the first and second patterned conductive layers.
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公开(公告)号：US10175309B2
公开(公告)日：2019-01-08
申请号：US15260501
申请日：2016-09-09
Applicant: PROLIFIC TECHNOLOGY INC.
Inventor： Hung-Ta Li , Po-Feng Lee
Abstract: An electromagnetic impedance sensing device includes a first substrate, a first patterned conductive layer, a second substrate, a second patterned conductive layer, a magneto-conductive wire and an encapsulation layer. The first substrate has a first surface, and the first patterned conductive layer is formed on the first surface. The second substrate has a second surface facing to the first surface, and the second patterned conductive layer is formed on the second surface and electrically contacted to the first patterned conductive layer. The first and second patterned conductive layers are physically integrated to define an accommodation space allowing the magneto-conductive wire passing there through. The magneto-conductive wire is encapsulated by the encapsulation layer to make the magneto-conductive wire electrically isolated from the first and second patterned conductive layers, respectively. At least one coil circuit surrounding the magneto-conductive wire is formed by the first and second patterned conductive layers.
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