公开(公告)号：US20220230839A1

公开(公告)日：2022-07-21

申请号：US17321126

申请日：2021-05-14

Applicant: PSK INC.

Inventor： Mu-Kyeom MUN

IPC: H01J37/16 ,  H01J37/32

Abstract: The inventive concept relates to an apparatus for processing a substrate. In an embodiment, the apparatus for processing the substrate includes a plasma chamber, a coil electrode installed around the plasma chamber, and a Faraday shield provided between the coil electrode and the plasma chamber. The Faraday shield includes a cutout having a plurality of slots formed in a vertical direction along a periphery of the plasma chamber, an upper rim provided at the top of the cutout, and a lower rim provided at the bottom of the cutout. The upper rim and the lower rim have a thermal expansion reduction means configured to reduce a difference in thermal deformation between the upper and the lower rim and the cutout.