公开(公告)号：US20240032423A1

公开(公告)日：2024-01-25

申请号：US18355976

申请日：2023-07-20

Applicant: PUKYONG NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION

Inventor： Junghwan KIM ,  Na Hyun KIM ,  Su Min OH ,  Hyeon Kwang KIM ,  Sung Heum PARK

IPC: H10K85/60 ,  H10K30/88 ,  H10K30/50

CPC classification number: H10K85/6574 ,  H10K30/88 ,  H10K30/50

Abstract: An encapsulant for encapsulating perovskite to prevent lead leakage therefrom, a method for encapsulating perovskite to prevent lead leakage therefrom, and a perovskite photoactive device including the encapsulant are disclosed. The encapsulant for encapsulating perovskite may contain a crown ether-based compound having a benzene ring substituted with an alkyl group. The perovskite encapsulating method may include coating, on a perovskite layer, a solution in which a crown ether-based compound having a benzene ring substituted with an alkyl group is dissolved in an organic solvent. The perovskite photoactive device includes an encapsulant encapsulating the perovskite layer to prevent the lead leakage therefrom.