公开(公告)号：US20230163055A1

公开(公告)日：2023-05-25

申请号：US17906619

申请日：2021-03-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： JUNICHI KIMURA ,  KAZUHIRO KAIBARA ,  NORIMITSU HOZUMI ,  KOUTARO DEGUCHI ,  ATSUSHI MATSUMOTO

IPC: H01L23/498 ,  H01L23/495 ,  H01L23/00

CPC classification number: H01L23/49811 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/32 ,  H01L2224/32225 ,  H01L23/49568

Abstract: A semiconductor module includes: a first switch element; a second switch element; a first conductor that is joined to the source electrode of the first switch element, the first switch element is placed on the first conductor; a second conductor that is joined to the source electrode of the second switch element, the second switch element is placed on the second conductor; a positive electrode conductor connected to the drain electrode of the first switch element; an output conductor connected to the first conductor and the drain electrode of the second switch element; a negative electrode conductor connected to the second conductor; a first control conductor connected to the gate electrode of the first switch element; a second control conductor connected to the gate electrode of the second switch element; a first voltage detection terminal provided on the first conductor; a second voltage detection terminal provided on the second conductor; and an exterior resin part having a polyhedral shape. The first voltage detection terminal and the second voltage detection terminal protrude from different exterior surfaces of the exterior resin part.