公开(公告)号：US11587733B2

公开(公告)日：2023-02-21

申请号：US17549951

申请日：2021-12-14

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Hirotaka Hisamura ,  Hideki Katayama

IPC分类号： H01G4/224 ,  H01G2/08 ,  H01G2/10 ,  H01G4/38 ,  H01G9/08 ,  H01G11/78

摘要： A capacitor includes a capacitor element, a case that houses the capacitor element and contains a resin, a metal plate insert molded in the case, and a filler resin filled in the case. The metal plate includes a main plate portion and a covered portion disposed along a perimeter of the main plate portion. The main plate portion has an outer surface exposed outwardly from an opening of the case. The covered portion has an outer surface covered by a peripheral portion of the case, the peripheral portion being disposed around the opening.