公开(公告)号：US10186479B2

公开(公告)日：2019-01-22

申请号：US15426142

申请日：2017-02-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hidenori Katsumura ,  Shinya Tokunaga ,  Masaya Sumita ,  Hiroyoshi Yoshida ,  Yasuhiro Sugaya ,  Kazuhide Uriu ,  Osamu Shibata

IPC: H01L23/495 ,  H01L25/00 ,  B60R11/04 ,  H01L23/31 ,  H01L23/498 ,  H01L23/64 ,  H01L23/00 ,  H01L49/02 ,  H04N5/225 ,  H01L23/48 ,  H01L23/367

Abstract: A semiconductor device includes a metal plate capacitor that includes a heat-resistant metal plate and a capacitor unit including a sintered dielectric formed on at least one surface of the heat-resistant metal plate, a semiconductor chip disposed on the metal plate capacitor, a connector configured to electrically connect the semiconductor chip and the metal plate capacitor, and a protector configured to protect the semiconductor chip, the metal plate capacitor, and the connector.