公开(公告)号：US20210202421A1

公开(公告)日：2021-07-01

申请号：US17057989

申请日：2019-05-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Jin JIN ,  Atsushi YAMAGUCHI ,  Yasuo FUKUHARA

IPC: H01L23/00

Abstract: An electronic-part-reinforcing thermosetting resin composition has: a viscosity of 5 Pa·s or less at 140° C.; a temperature of 150° C. to 170° C. as a temperature corresponding to a maximum peak of an exothermic curve representing a curing reaction; and a difference of 20° C. or less between the temperature corresponding to the maximum peak and a temperature corresponding to one half of the height of the maximum peak in a temperature rising range of the exothermic curve.