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公开(公告)号：US20220208671A1
公开(公告)日：2022-06-30
申请号：US17697184
申请日：2022-03-17
Inventor： Atsushi YAMAGUCHI , Yasuo FUKUHARA
IPC: H01L23/498 , H01L23/00
Abstract: A semiconductor-mounted product includes a semiconductor package, a wiring substrate, four or more soldered portions, and a resin-reinforced portion. Each of the soldered portions electrically connects the semiconductor package to the wiring of the wiring substrate. The resin-reinforced portion is formed on a side surface of each of the soldered portions. Each of the soldered portions has a first solder region formed closer to the semiconductor package than the wiring substrate and a second solder region formed closer to the wiring substrate than the semiconductor package. A proportion of a void present in a polygon connecting centers of soldered portions located at outermost positions among the soldered portions to a sum of the void and the resin-reinforced portion is from 10% to 99%, inclusive.
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2.发明申请公开(公告)号：US20200172666A1
公开(公告)日：2020-06-04
申请号：US16615343
申请日：2017-06-09
Inventor： Yasuo FUKUHARA , Atsushi YAMAGUCHI
Abstract: A thermosetting resin composition contains a thermosetting resin, an activator, and a thixotropy-imparting agent. The thermosetting resin contains a main agent and a curing agent. The main agent contains a di- or higher functional oxetane compound.
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Patent Agency Ranking
公开(公告)号：US20190355655A1
公开(公告)日：2019-11-21
申请号：US16476071
申请日：2017-01-17
Inventor： Atsushi YAMAGUCHI , Yasuo FUKUHARA
IPC: H01L23/498 , H01L23/00
Abstract: A semiconductor-mounted product includes a semiconductor package, a wiring substrate, four or more soldered portions, and a resin-reinforced portion. Each of the soldered portions electrically connects the semiconductor package to the wiring of the wiring substrate. The resin-reinforced portion is formed on a side surface of each of the soldered portions. Each of the soldered portions has a first solder region formed closer to the semiconductor package than the wiring substrate and a second solder region formed closer to the wiring substrate than the semiconductor package. A proportion of a void present in a polygon connecting centers of soldered portions located at outermost positions among the soldered portions to a sum of the void and the resin-reinforced portion is from 10% to 99%, inclusive.
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公开(公告)号：US20160329295A1
公开(公告)日：2016-11-10
申请号：US14907256
申请日：2015-07-09
Inventor： Atsushi YAMAGUCHI , Yasuo FUKUHARA
IPC: H01L23/00
CPC classification number: H01L24/73 , H01L24/11 , H01L24/17 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2224/11332 , H01L2224/13111 , H01L2224/13113 , H01L2224/13139 , H01L2224/13147 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2224/81191 , H01L2224/81801 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H01L2924/014
Abstract: A semiconductor-mounted product includes a semiconductor package, a circuit board, a solder bonding part, and a resin reinforcing part. Wiring is formed on the surface of the circuit board, and the semiconductor package is mounted on the circuit board. The solder bonding part electrically connects the semiconductor package with the wiring. The resin reinforcing part is formed on a side surface of the solder bonding part such that the solder bonding part is partially exposed. The bonding part has a first solder region formed closer to the semiconductor package than the circuit board, and a second solder region formed closer to the circuit board than the semiconductor package.
Abstract translation: 半导体安装的产品包括半导体封装，电路板，焊接部分和树脂增强部分。 在电路板的表面上形成布线，半导体封装安装在电路板上。 焊接接合部将半导体封装与布线电连接。 树脂加强部形成在焊料接合部的侧面，使得焊接部分露出。 接合部分具有形成为比电路板更靠近半导体封装的第一焊料区域和形成为比半导体封装件更靠近电路板的第二焊料区域。
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公开(公告)号：US20240228855A9
公开(公告)日：2024-07-11
申请号：US18548316
申请日：2022-03-09
Inventor： Keiichi KOMATSU , Asahi KASUE , Atsushi YAMAGUCHI
CPC classification number: C09K5/14 , C08K3/22 , C08L63/00 , C08K2003/2227 , C08K2201/001 , C08L2207/02
Abstract: A thermally conductive resin composition includes a first resin phase, a second resin phase, and a thermally conductive filler. The first resin phase and the second resin phase are phase-separated. The thermally conductive filler in the first resin phase has a density higher than a density of the thermally conductive filler in the second resin phase.
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公开(公告)号：US20240132767A1
公开(公告)日：2024-04-25
申请号：US18548316
申请日：2022-03-09
Inventor： Keiichi KOMATSU , Asahi KASUE , Atsushi YAMAGUCHI
CPC classification number: C09K5/14 , C08K3/22 , C08L63/00 , C08K2003/2227 , C08K2201/001 , C08L2207/02
Abstract: A thermally conductive resin composition includes a first resin phase, a second resin phase, and a thermally conductive filler. The first resin phase and the second resin phase are phase-separated. The thermally conductive filler in the first resin phase has a density higher than a density of the thermally conductive filler in the second resin phase.
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公开(公告)号：US20210202421A1
公开(公告)日：2021-07-01
申请号：US17057989
申请日：2019-05-24
Inventor： Jin JIN , Atsushi YAMAGUCHI , Yasuo FUKUHARA
IPC: H01L23/00
Abstract: An electronic-part-reinforcing thermosetting resin composition has: a viscosity of 5 Pa·s or less at 140° C.; a temperature of 150° C. to 170° C. as a temperature corresponding to a maximum peak of an exothermic curve representing a curing reaction; and a difference of 20° C. or less between the temperature corresponding to the maximum peak and a temperature corresponding to one half of the height of the maximum peak in a temperature rising range of the exothermic curve.
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