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公开(公告)号:US20180107099A1
公开(公告)日:2018-04-19
申请号:US15496463
申请日:2017-04-25
Inventor: Koji YASUDA , Kenji KUSUNOKI , Fumitaka KIKUCHI
CPC classification number: G03B17/55 , G03B21/16 , G06F1/20 , H04N5/2252 , H04N5/23293 , H05K7/2039 , H05K7/2049
Abstract: An electronic device includes: an electronic part; an external case that covers the electronic part and constitutes an exterior; and a heat dissipation frame that transmits heat generated from the electronic part to the external case. The external case includes a top case, a front case, and a rear case, while the heat dissipation frame includes a first heat dissipation frame, a second heat dissipation frame, and a third heat dissipation frame provided independently from each other. Mechanical fixation is made to combine the top case and the first heat dissipation frame into one body, to combine the front case and the second heat dissipation frame into one body, and to combine the rear case and the third heat dissipation frame into one body.
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公开(公告)号:US20240179385A1
公开(公告)日:2024-05-30
申请号:US18518501
申请日:2023-11-23
Inventor: Masakazu YASUNAGA , Kenji KUSUNOKI , Yujiro KITAGAWA
Abstract: An imaging apparatus includes a housing, an imaging element provided in the housing, a first antenna, a second antenna, an IC chip electrically connected to both the first and second antennas and executing wireless communication via the first and second antennas, and a first circuit board on which the IC chip is mounted. When viewed in a first direction that is a normal direction of a light receiving surface of the imaging element and is a front-rear direction of the housing, the first antenna is arranged at one end portion of the housing in a second direction orthogonal to the first direction, and the second antenna is arranged at the other end portion of the housing in the second direction.
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