公开(公告)号：US20180351006A1

公开(公告)日：2018-12-06

申请号：US15779385

申请日：2016-11-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： YOSUKE HAGIHARA ,  YOICHI NISHIJIMA ,  TAKAFUMI OKUDO ,  KATSUMI KAKIMOTO ,  NAYUTA MINAMI ,  NOBUAKI SHIMAMOTO

IPC: H01L31/024 ,  G01J1/02 ,  G01J5/04 ,  G01J5/08 ,  G01J5/12 ,  H01L27/144 ,  G01J1/42 ,  H01L35/32 ,  H05K1/18

CPC classification number: G01J1/02

Abstract: Infrared sensor as an aspect of the present disclosure includes substrate, processor disposed on substrate, infrared sensing element disposed above processor, package that is disposed on substrate and covers infrared sensing element, and heat insulating section disposed between infrared sensing element and processor at an overlapped region of processor and infrared sensing element. Heat insulating section has a thermal conductivity smaller than substrate.