公开(公告)号：US12221536B2

公开(公告)日：2025-02-11

申请号：US17921263

申请日：2021-03-25

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Cheng Ping Lin ,  Toshiyuki Makita ,  Naohito Fukuya

IPC: H05K1/03 ,  B32B15/092 ,  B32B15/098 ,  B32B27/20 ,  B32B27/38 ,  B32B27/42 ,  C08J5/18 ,  C08L63/00 ,  B32B15/20

Abstract: A component (A1) thereof includes an epoxy resin having at least one of a naphthalene skeleton or a biphenyl skeleton. A component (A2) thereof includes a phenolic resin having at least one of the naphthalene skeleton or the biphenyl skeleton. A component (B) thereof includes a high molecular weight substance having structures expressed by at least formulae (b2) and (b3) out of formulae (b1), (b2), and (b3) and having a weight average molecular weight equal to or greater than 200,000 and equal to or less than 850,000. A component (C1) thereof includes a first filler obtained by subjecting a first inorganic filler to surface treatment using a first silane coupling agent expressed by formula (c1). A component (C2) thereof includes a second filler obtained by subjecting a second inorganic filler to surface treatment using a second silane coupling agent expressed by formula (c2).

公开(公告)号：US10791633B2

公开(公告)日：2020-09-29

申请号：US16471831

申请日：2017-12-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akira Ito ,  Eiichiro Saito ,  Naohito Fukuya

IPC: H05K3/46 ,  H05K1/03 ,  B32B7/027 ,  H05K1/02

Abstract: A thick conductor built-in type printed wiring board includes a printed wiring board, an insulating resin layer, an insulating base material layer, and a conductor layer. The printed wiring board includes an insulating layer including a cured product of a first resin composition, and a circuit provided on one main surface or both main surfaces of the insulating layer, the circuit having a plurality of conductor wirings each having a thickness ranging from 105 μm to 630 μm, inclusive. The insulating resin layer covers a surface of the printed wiring board on which the circuit is provided, and includes a cured product of a second resin composition and includes no fibrous base material. The insulating base material layer covers the insulating resin layer, and includes a cured product of a third resin composition and a fibrous base material. The conductor layer covers the insulating base material layer. The thick conductor built-in type printed wiring board does not include a void having a diameter of more than or equal to 10 μm inside the thick conductor built-in type printed wiring board.