公开(公告)号：US10791633B2

公开(公告)日：2020-09-29

申请号：US16471831

申请日：2017-12-18

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akira Ito ,  Eiichiro Saito ,  Naohito Fukuya

IPC: H05K3/46 ,  H05K1/03 ,  B32B7/027 ,  H05K1/02

Abstract: A thick conductor built-in type printed wiring board includes a printed wiring board, an insulating resin layer, an insulating base material layer, and a conductor layer. The printed wiring board includes an insulating layer including a cured product of a first resin composition, and a circuit provided on one main surface or both main surfaces of the insulating layer, the circuit having a plurality of conductor wirings each having a thickness ranging from 105 μm to 630 μm, inclusive. The insulating resin layer covers a surface of the printed wiring board on which the circuit is provided, and includes a cured product of a second resin composition and includes no fibrous base material. The insulating base material layer covers the insulating resin layer, and includes a cured product of a third resin composition and a fibrous base material. The conductor layer covers the insulating base material layer. The thick conductor built-in type printed wiring board does not include a void having a diameter of more than or equal to 10 μm inside the thick conductor built-in type printed wiring board.

公开(公告)号：US11114354B2

公开(公告)日：2021-09-07

申请号：US16324199

申请日：2017-08-22

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Akira Ito ,  Eiichiro Saito ,  Kengo Yamanouti

IPC: H05K1/00 ,  H01L23/14 ,  H01L23/12 ,  H05K3/46 ,  H01L23/15 ,  H05K1/03 ,  H05K1/02

Abstract: A printed wiring board includes: an inner insulating layer including a conductive wire; a first outermost insulating layer disposed on a first surface of the inner insulating layer; and a second outermost insulating layer disposed on a second surface of the inner insulating layer. A bending elastic modulus of each of the first outermost insulating layer and the second outermost insulating layer ranges from ¼ to ¾, inclusive, of a bending elastic modulus of the inner insulating layer. A glass transition temperature of each of the first outermost insulating layer and the second outermost insulating layer falls within ±20° C. of a glass transition temperature of the inner insulating layer.

公开(公告)号：US12066337B2

公开(公告)日：2024-08-20

申请号：US17709722

申请日：2022-03-31

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuta Moriura ,  Hironobu Ukitsu ,  Susumu Uragami ,  Takashi Matsumoto ,  Hiroyuki Furuya ,  Akira Ito

IPC: G01L1/14

CPC classification number: G01L1/144

Abstract: A load sensor includes: a base member being insulative and having elasticity; an electrode having elasticity and formed on an upper face of the base member; and a wire member being electrically conductive and disposed so as to be superposed on an upper face of the electrode, a surface of the wire member being covered by a dielectric body. A ratio of a thickness of the electrode to a thickness of the base member is not less than 0.02 and not greater than 0.3.