公开(公告)号：US20250142769A1

公开(公告)日：2025-05-01

申请号：US18921971

申请日：2024-10-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Youji SHIRATO ,  Ryosuke USUI ,  Naoki SAITOU ,  Norihiro KAWAMURA

IPC: H05K7/20

Abstract: A liquid immersion cooling device includes an electronic device and a cooling medium. The electronic device includes a circuit board, a heat generator mounted on the circuit board, a heat dissipator, and a thermal conductive sheet interposed between the heat generator and the heat dissipator. The cooling medium is arranged to immerse the electronic device at least partially. At least part of the thermal conductive sheet is made of a porous material.

公开(公告)号：US20230247806A1

公开(公告)日：2023-08-03

申请号：US18098989

申请日：2023-01-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Youji SHIRATO ,  Naoki SAITOU ,  Norihiro KAWAMURA

IPC: H05K7/20

CPC classification number: H05K7/209

Abstract: An electrical device according to the present disclosure includes a heat generator, a heat dissipator, a thermal conductive sheet, and a thermal conductive fluid. The heat generator has a first surface. The heat dissipator has a second surface that faces the first surface. The thermal conductive sheet and the thermal conductive fluid are both interposed between the first surface and the second surface. The first surface and the second surface face each other in their respective counter regions. Each of the counter regions includes a first region and a second region when viewed in a direction in which the first and second surfaces face each other. The first region holds the thermal conductive fluid but does not receive the thermal conductive sheet. The second region is adjacent to the first region and receives the thermal conductive sheet.