COMPONENT MOUNTING SYSTEM AND TRACE DATA ACQUISITION METHOD

    公开(公告)号:US20190228520A1

    公开(公告)日:2019-07-25

    申请号:US16243153

    申请日:2019-01-09

    Abstract: A component mounting system includes a component mounter, and a server. The component mounter includes a component information recognizer, and a data output unit. The component information recognizer recognizes component information by imaging a character of the component information printed on a surface of a component. The data output unit outputs the component information together with board information to the server, the component information being recognized by the component information recognizer, the board information being information of a board on which the component is installed.

    Method for manufacturing mounting substrate, and component mounting device

    公开(公告)号:US12289836B2

    公开(公告)日:2025-04-29

    申请号:US17637101

    申请日:2020-06-09

    Abstract: A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.

Patent Agency Ranking