公开(公告)号：US20210157427A1

公开(公告)日：2021-05-27

申请号：US17098901

申请日：2020-11-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： HIROSHI MORIOKA ,  TAKASHI MORIMOTO ,  HIDEAKI ETO ,  TOMOYA MORIURA ,  WAHEI AGEMIZU

IPC: G06F3/044 ,  H01L25/075 ,  H01L33/60 ,  H01L33/48 ,  B29C45/14 ,  B29C45/16

Abstract: A molded body for an electronic function includes a first film in which one surface thereof constitutes an external appearance surface, a second film in which an electronic component is mounted on a surface thereof facing a surface of the first film opposite to the external appearance surface, and a first resin that fills a space between the first film and the second film. The first resin has a cavity, and the cavity is filled with a second resin, and the electronic component is disposed in the cavity and surrounded by the second resin.