公开(公告)号：US12009586B2

公开(公告)日：2024-06-11

申请号：US17429144

申请日：2020-02-06

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takuya Mino ,  Takanori Aketa

IPC: H05K1/09 ,  H01Q1/24 ,  H01Q1/38 ,  H05K3/12 ,  H05K3/28

CPC classification number: H01Q1/38 ,  H01Q1/24 ,  H05K1/092 ,  H05K3/12 ,  H05K3/28

Abstract: The conductive device includes a substrate and an electrically conductive portion. The electrically conductive portion is provided on the substrate. The electrically conductive portion includes an electrically conductive part and a low resistance conductive layer. The electrically conductive part is provided on the substrate and includes an electrically conductive particle and an organic binder. The low resistance conductive layer covers at least part of a surface of the electrically conductive part and has lower resistivity than the electrically conductive part.